-
公开(公告)号：US20230043951A1
公开(公告)日：2023-02-09
申请号：US17790308
申请日：2021-08-31
发明人： Ke WANG , Zhanfeng CAO , Xinhong LU , Qi QI , Yan QU , Zhiwei LIANG , Yingwei LIU , Dapeng XUE , Guoqiang WANG , Jianguo WANG , Song LIU , Yongfei LI , Ting ZENG , Huan LIU , Wanru DONG , Heren GUI , Jian YANG , Haifeng HU , Yu JIANG , Peng XU , Weiwei CHU , Qi GAO
IPC分类号： H01L33/62 , H01L25/075 , H01L21/48 , H01L23/498
摘要： An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.
-
公开(公告)号：US20210399185A1
公开(公告)日：2021-12-23
申请号：US17283512
申请日：2020-05-08
发明人： Dongni LIU , Minghua XUAN , Chao LIU , Yingwei LIU
摘要： The present disclosure provides a display panel and a manufacturing method. The display panel includes: a base substrate including a display surface and a display back surface arranged opposite to each other, and a side surface connected to the display surface and the display back surface; a plurality of first wirings on the display surface of the base substrate; a plurality of second wirings on the display back surface of the base substrate; a transition body on the side surface of the base substrate and in contact with the first wirings and the second wirings, a surface of the transition body away from the side surface being a smooth curved surface; and a plurality of connection lines covering an outer surface of the transition body, each first wiring being electrically connected to a corresponding second wiring via a corresponding connection line.
-
公开(公告)号：US20210359184A1
公开(公告)日：2021-11-18
申请号：US17265806
申请日：2020-05-13
发明人： Zhanfeng CAO , Yingwei LIU , Ke WANG , Dongni LIU , Minghua XUAN , Guangcai YUAN , Lei CHEN , Xue DONG
摘要： The present disclosure provides a driving substrate, a method for preparing the same, and a flexible display device. The driving substrate includes: a base substrate; a first driving function layer arranged on a first surface of the base substrate, the first driving function layer including a plurality of driving thin film transistors and a plurality of signal wirings, and at least one of the plurality of signal wirings being of a single-layer structure and having a thickness greater than a threshold; a pad layer arranged on a surface of the first driving function layer away from the base substrate, the pad layer including a plurality of first pads and a plurality of second pads, and each first pad being connected to a first electrode of the corresponding driving thin film transistor and each second pad being connected to a common electrode line in the plurality of signal wirings.
-
公开(公告)号：US20210305283A1
公开(公告)日：2021-09-30
申请号：US17265228
申请日：2020-05-19
发明人： Muxin DI , Zhiwei LIANG , Yingwei LIU , Ke WANG , Zhanfeng CAO , Guangcai YUAN
IPC分类号： H01L27/12 , H01L23/498 , H01L25/075 , H01L29/786 , H01L33/62
摘要： A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.
-
公开(公告)号：US20240365478A1
公开(公告)日：2024-10-31
申请号：US18769438
申请日：2024-07-11
发明人： Guoteng LI , Shuilang DONG , Xinhong LU , Liuqing LI , Jingshang ZHOU , Baoman LI , Zhao CUI , Yingwei LIU
CPC分类号： H05K3/4691 , H05K1/111 , H05K3/16 , H05K3/4007 , H05K5/0069 , H05K2203/0143 , H05K2203/0723 , H05K2203/1377
摘要： Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.
-
公开(公告)号：US20230097502A1
公开(公告)日：2023-03-30
申请号：US16982217
申请日：2019-12-19
发明人： Zhiwei LIANG , Yingwei LIU , Zhijun LV , Ke WANG , Zhanfeng CAO , Hsuanwei MAI , Guangcai YUAN , Muxin DI
IPC分类号： H01L33/62 , H01L25/075 , H01L23/00
摘要： A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.
-
公开(公告)号：US20220406749A1
公开(公告)日：2022-12-22
申请号：US17638703
申请日：2020-02-28
发明人： Zhanfeng CAO , Jiushi WANG , Ke WANG , Guocai ZHANG , Junwei YAN , Yingwei LIU , Haitao HUANG , Guangcai YUAN
IPC分类号： H01L23/00 , H01L33/62 , H01L25/075 , H01L25/16
摘要： Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.
-
公开(公告)号：US20220375966A1
公开(公告)日：2022-11-24
申请号：US17772234
申请日：2021-05-18
发明人： Xue DONG , Guangcai YUAN , Ce NING , Zhiwei LIANG , Feng GUAN , Zhaohui QIANG , Yingwei LIU , Ke WANG , Zhanfeng CAO
摘要： An array substrate includes a base substrate, a driving circuit layer, and a functional device layer which are sequentially stacked; the driving circuit layer is provided with first driving circuits, and each first driving circuit at least comprises a driving transistor; and the driving circuit layer comprises a first gate layer, a first gate insulation layer, a semiconductor layer, a second gate insulation layer, a second gate layer, an interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked on one side of the base substrate.
-
公开(公告)号：US20210408168A1
公开(公告)日：2021-12-30
申请号：US16605493
申请日：2019-04-28
发明人： Shuang LIANG , Yingwei LIU , Zhanfeng CAO , Zhiwei LIANG , Muxin DI
IPC分类号： H01L27/32 , H01L41/113
摘要： Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.
-
公开(公告)号：US20210217646A1
公开(公告)日：2021-07-15
申请号：US16758074
申请日：2019-01-29
发明人： Yingwei LIU , Zhanfeng CAO , Muxin Dl , Ke WANG , Zhiwei LIANG , Renquan GU
IPC分类号： H01L21/683 , H01L21/677 , H01L33/62
摘要： The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.
-
-
-
-
-
-
-
-
-
搜索结果
40 条记录 (耗时 0.023 秒)
