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公开(公告)号:US20220115484A1
公开(公告)日:2022-04-14
申请号:US17266625
申请日:2020-03-27
Applicant: BOE Technology Group Co., Ltd.
Inventor: Pengcheng LU , Shengji YANG , Kuanta HUANG , Xiaochuan CHEN , Yage SONG , Yanming WANG , Hui WANG , Dongdong DUAN , Jiantong LI , Xiao BAI , Yunlong LI , Shuai TIAN , Zhijian ZHU , Yu AO , Junbo WEI , Chao PU , Yuanlan TIAN
IPC: H01L27/32
Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.
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公开(公告)号:US20240172543A1
公开(公告)日:2024-05-23
申请号:US17779140
申请日:2021-06-30
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jie SUN , Hui WANG , Yanming WANG , Yage SONG , Shengji YANG , Yongchun ZHANG , Xiaojun MAO , Yunjiang ZHANG , Meijian LUO
IPC: H10K59/80 , H10K59/131
CPC classification number: H10K59/8794 , H10K59/131 , H10K59/8792
Abstract: The embodiment of the present disclosure provides a display module, which includes a circuit board and a display panel provided on a first surface of the circuit board, wherein the display panel includes a display region and a non-display region located at a periphery of the display region; the first surface of the circuit board is also provided with a frame body, the display panel is located within the frame body, a fixing adhesive is filled between a peripheral edge of the display panel and the frame body, and the fixing adhesive also covers the non-display region of the display panel.
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公开(公告)号:US20210351353A1
公开(公告)日:2021-11-11
申请号:US16473950
申请日:2018-12-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Pengcheng LU , Xiaochuan CHEN , Shengji YANG , Kuanta HUANG , Hui WANG , Yanming WANG , Weihai WANG , Guohong QIN , Yage SONG , Jiantong LI
Abstract: A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion.
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公开(公告)号:US20240196670A1
公开(公告)日:2024-06-13
申请号:US17794829
申请日:2021-09-30
Inventor: Zhijian ZHU , Pengcheng LU , Junbo WEI , Xiao BAI , Jie SUN , Yage SONG , Shengji YANG , Xiaochuan CHEN
IPC: H10K59/131 , H10K59/95
CPC classification number: H10K59/131 , H10K59/95
Abstract: Embodiments of the present disclosure provide a display substrate, a related display motherboard, and a related display panel. The display substrate has a central region and a peripheral region surrounding the central region. The display substrate includes a substrate, a dielectric layer located on the substrate and including a first portion and a second portion arranged in sequence in a direction perpendicular to the substrate, a pad located within the peripheral region and on a surface of the second portion on a side away from the substrate, and a conductive sealing part located within the peripheral region and in the dielectric layer, wherein the conductive sealing part includes at least a first portion adjacent to the pad in a direction parallel to the substrate, and wherein the first portion of the conductive sealing part is covered by the second portion of the dielectric layer.
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公开(公告)号:US20220140277A1
公开(公告)日:2022-05-05
申请号:US17259238
申请日:2020-03-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Shengji YANG , Xue DONG , Xiaochuan CHEN , Pengcheng LU , Hui WANG , Yanming WANG , Yage SONG , Jiantong LI , Kuanta HUANG
Abstract: A display panel includes a driving back plate, a first insulating layer, and a light-emitting device layer sequentially stacked. The driving back plate includes a first reflecting electrode layer. The first reflecting electrode layer includes first primary reflecting electrodes in a display area and first auxiliary reflecting electrodes in a peripheral area. The light-emitting device layer includes a second reflecting electrode layer including second primary reflecting electrodes in the display area and second auxiliary reflecting electrodes in the peripheral area. The second primary reflecting electrodes are in one-to-one correspondence and electrically connected with the first primary reflecting electrodes. The orthographic projection of the second primary reflecting electrode on the first reflecting electrode layer are located within the first primary reflecting electrode.
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公开(公告)号:US20200075706A1
公开(公告)日:2020-03-05
申请号:US16394254
申请日:2019-04-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Pengcheng LU , Kuanta HUANG , Xiaochuan CHEN , Shengji YANG , Hui WANG , Yanming WANG , Weihai WANG , Guohong QIN , Rongrong SHI , Yage SONG , Jiantong LI
Abstract: A display panel includes a base substrate, a first electrode contact portion, a light emitting layer, and a first electrode. The first electrode contact portion is disposed on the base substrate and surrounding a display area, and is separated from the display area by an isolation area. The light emitting layer covers the display area and at least a portion of the isolation area, and extends at least partially to an inner edge of the first electrode contact portion or a surface of the first electrode contact portion away from the base substrate. The first electrode is disposed on the light emitting layer and a portion of the first electrode contact portion that is not covered by the light emitting layer.
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