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    LIGHT-EMITTING ELEMENT
    4.
    发明公开
    LIGHT-EMITTING ELEMENT 审中-公开

    公开(公告)号：US20240023386A1

    公开(公告)日：2024-01-18

    申请号：US18317113

    申请日：2023-05-15

    Applicant: TAIZHOU GUANYU TECHNOLOGY CO., LTD.

    Inventor： HUEI-SIOU CHEN ,  KUO-CHENG HSU ,  LI-CHEN WEI

    IPC: H10K59/126 ,  H10K59/80 ,  H10K59/95 ,  H10K85/60

    CPC classification number: H10K59/126 ,  H10K59/8051 ,  H10K59/873 ,  H10K59/95 ,  H10K85/631

    Abstract: A light-emitting element comprises a substrate, a plurality of light shielding layers, a capping layer, a conductive layer and a plurality of protrusions. The plurality of light shielding layers is under the substrate. The capping layer contacts a first surface of the substrate and covers the plurality of light shielding layers. The conductive layer contacts a second surface of the substrate. The plurality of protrusions is arranged on the second surface of the substrate and covers a part of the conductive layer, and an organic light-emitting unit comprising an organic material is disposed between two adjacent protrusions of the plurality of protrusions. One of the plurality of protrusions has an edge, which is offset from an edge of one of the plurality of light shielding layers in the longitudinal direction from each other.

    EXPOSURE APPARATUS, IMAGE-FORMING APPARATUS AND MANUFACTURING METHOD
    5.
    发明申请
    EXPOSURE APPARATUS, IMAGE-FORMING APPARATUS AND MANUFACTURING METHOD 有权

    公开(公告)号：US20250036038A1

    公开(公告)日：2025-01-30

    申请号：US18783123

    申请日：2024-07-24

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： KOICHIRO NAKANISHI

    IPC: G03G15/04 ,  H10K59/80 ,  H10K59/95

    Abstract: An exposure apparatus includes: light-emitting chips arranged in a staggered manner along a reference line that is parallel to an axial direction of a photosensitive member, each of which has a silicon substrate and a light-emitting element array that is an array of organic electro luminescence (EL) elements formed on a first surface of the silicon substrate; and a rod lens array that images light from the light-emitting element arrays of the light-emitting chips onto a surface of the photosensitive member. An interval between a first side of the silicon substrate of each light-emitting chip and the light-emitting element array of the light-emitting chip is equal to or larger than 20 micrometers, the first side being parallel to the reference line and closer to the reference line among sides of the silicon substrate.

    Display Panel and Display Apparatus
    6.
    发明申请
    Display Panel and Display Apparatus 有权

    公开(公告)号：US20250008801A1

    公开(公告)日：2025-01-02

    申请号：US18689583

    申请日：2023-01-03

    Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Ling Shi ,  Yipeng Chen

    IPC: H10K59/35 ,  H10K59/131 ,  H10K59/95

    Abstract: A display panel includes a substrate, sub-pixels, data lines and a pixel defining layer. The data lines are divided into data line groups. Each data line group includes a first data line, a second data line and a third data line sequentially arranged in a first direction. Adjacent second and third data lines are substantially symmetrical about an axis. The second data line and the third data line each include first straight segments and first bending segments alternately connected. For first bending segments of the adjacent second and third data lines, each is bent in a direction away from another. The pixel defining layer is provided therein with photosensitive openings. An orthogonal projection, on the substrate, of a photosensitive opening is located between orthogonal projections, on the substrate, of adjacent first bending segments of a second data line and a third data line.

    ELECTRONIC DEVICE
    8.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240268204A1

    公开(公告)日：2024-08-08

    申请号：US18040075

    申请日：2022-08-26

    Applicant: HONOR DEVICE CO., LTD.

    Inventor： Guochao FU ,  Yuanru YANG

    IPC: H10K59/80 ,  H01L25/18 ,  H10K59/95

    CPC classification number: H10K59/8794 ,  H01L25/18 ,  H10K59/87 ,  H10K59/95

    Abstract: An electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer component has a recess, and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess.

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