公开(公告)号：US11239198B2

公开(公告)日：2022-02-01

申请号：US16830834

申请日：2020-03-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lili Wang ,  Haiwei Sun ,  Zhenxing Tang ,  Feng Qu ,  Jing Liu ,  Chao Liu ,  Chuhang Wang ,  Qiangwei Cui ,  Ke Meng ,  Linhui Gong

IPC: H01L23/00 ,  H01L25/18 ,  H01L25/00

Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.