THREE-DIMENSIONAL DISPLAY PANEL AND THREE-DIMENSIONAL DISPLAY APPARATUS

    公开(公告)号:US20200244946A1

    公开(公告)日:2020-07-30

    申请号:US15761334

    申请日:2017-03-23

    摘要: The present application discloses a display panel including a base substrate; a first micro LED array having a plurality of first micro LED pixels in a matrix along a first direction and a second direction on the base substrate; and a second micro LED array having a plurality of second micro LED pixels on a side of the first micro LED array distal to the base substrate, the plurality of second micro LED pixels being grouped into a plurality of groups of second micro LED pixels successively along the second direction, each of the plurality of groups of second micro LED pixels substantially along the first direction and comprising one or more rows of second micro LED pixels substantially along the first direction. Adjacent groups of the plurality of groups of second micro LED pixels are spaced apart from each other thereby exposing a portion of the first micro LED array.

    Three-dimensional display panel and three-dimensional display apparatus

    公开(公告)号:US10924726B2

    公开(公告)日:2021-02-16

    申请号:US15761334

    申请日:2017-03-23

    摘要: The present application discloses a display panel including a base substrate; a first micro LED array having a plurality of first micro LED pixels in a matrix along a first direction and a second direction on the base substrate; and a second micro LED array having a plurality of second micro LED pixels on a side of the first micro LED array distal to the base substrate, the plurality of second micro LED pixels being grouped into a plurality of groups of second micro LED pixels successively along the second direction, each of the plurality of groups of second micro LED pixels substantially along the first direction and comprising one or more rows of second micro LED pixels substantially along the first direction. Adjacent groups of the plurality of groups of second micro LED pixels are spaced apart from each other thereby exposing a portion of the first micro LED array.

    WAFER PART AND CHIP PACKAGING METHOD
    10.
    发明申请

    公开(公告)号:US20190006197A1

    公开(公告)日:2019-01-03

    申请号:US15991374

    申请日:2018-05-29

    摘要: A wafer part and a chip packaging method are provided. The wafer part is obtained by processing a round wafer. A profile of the wafer part is an inscribed closed pattern of a profile of the round wafer, and area of the inscribed closed pattern is larger than area of an inscribed square of the profile of the round wafer; the inscribed closed pattern includes an even number of straight edges, and each one of straight edges is parallel to another of the straight edges and has a length equal to that of the another of the straight edges. The chip packaging method includes: fixing the plurality of wafer parts on a first panel level substrate and forming a packaging structure on each chip; wherein the plurality of wafer parts are arranged closely on the first panel level substrate without being overlapped with each other.