专利检索 ap:("BOE TECHNOLOGY GROUP CO., LTD." OR "HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.") AND inv:"Yadong LIU" 第 1 页

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发明申请
AUTOMATIC BONDING APPARATUS AND BONDING METHOD 审中-公开

公开(公告)号：US20180107032A1

公开(公告)日：2018-04-19

申请号：US15541781

申请日：2016-09-27

申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Zhuang Liu , Baogui CAO , Hao CHEN , Min YOU , Guanghua HU , Rei REN , Yadong LIU , Yinchu ZHAO

IPC分类号： G02F1/13 , G02F1/1333 , B32B37/12 , B65G49/06 , B32B37/10

CPC分类号： G02F1/1303 , B32B37/1018 , B32B37/12 , B32B2037/1253 , B65G49/068 , G02F1/13338

摘要： A bonding apparatus and a bonding method, the bonding apparatus includes at least one first bonding device, at least two second bonding devices and a transferring device. The first bonding device is configured to visually align and bond an optically clear adhesive and a first component, to form a first bonding component. The transferring device is configured to transfer the first bonding component to the second bonding device. The second bonding device is configured to visually align and bond the first bonding component and a second component, to form a second bonding component.