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公开(公告)号:US20240116285A1
公开(公告)日:2024-04-11
申请号:US18479846
申请日:2023-10-03
申请人: ROLLS-ROYCE plc
发明人: Charlie RICCARD
CPC分类号: B32B37/146 , B32B3/12 , B32B7/12 , B32B37/0046 , B32B37/1018 , B32B37/12 , B32B2309/68 , B32B2603/00
摘要: A tool for curing and bonding a honeycomb stack with void filler. The tool has a first tool piece with a cavity for receiving layers of unfilled honeycomb material and a second tool piece with a cavity for receiving at least one layer of void-filled honeycomb. The tool also has a compression seal arrangement that creates gas-tight seals between the first tool piece, second tool piece, and a barrier layer positioned between them, with a further seal covering the cavity of the first tool piece to form a gas-tight sealed volume including the first cavity, a pressure plate to cover the cavity of the second tool piece to apply pressure to the void-filled honeycomb, with a further seal to cover the pressure plate to form a gas-tight sealed volume including the second cavity.
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公开(公告)号:US11938010B2
公开(公告)日:2024-03-26
申请号:US16917308
申请日:2020-06-30
申请人: ONTEX BV , ONTEX GROUP NV
发明人: Ainas Weber , Manfred Breu , Christel Mailinger , Thomas Heege
IPC分类号: A61F13/532 , A61F13/15 , A61F13/42 , A61F13/475 , A61F13/531 , A61F13/533 , A61F13/534 , A61F13/539 , B32B37/02 , B32B37/10 , B32B37/14 , B32B37/22 , A61F13/53 , B29D99/00 , B29K23/00
CPC分类号: A61F13/532 , A61F13/15658 , A61F13/42 , A61F13/4756 , A61F13/531 , A61F13/533 , A61F13/534 , A61F13/539 , B32B37/02 , B32B37/1018 , B32B37/142 , B32B37/22 , A61F13/1565 , A61F2013/15926 , A61F2013/423 , A61F2013/530131 , A61F2013/530481 , A61F2013/530868 , A61F2013/53908 , B29D99/0064 , B29K2023/00 , B29K2713/00
摘要: An absorbent core comprising substantially continuous zones of one or more high fluid distribution structures and discontinuous zones of fluid absorption structures surrounding the one or more high fluid distribution structures, wherein the one or more high fluid distribution structures are arranged to distribute fluid across the absorbent core at a speed that is faster than the speed of fluid distribution across the absorbent core by said discontinuous fluid absorption structures, and wherein said continuous zones extend along a path that is substantially parallel to at least a portion of the perimeter of the core, said portion of the perimeter of the core comprising at least a portion of the sides of the core and one of the ends of the core.
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公开(公告)号:US11899887B1
公开(公告)日:2024-02-13
申请号:US17888709
申请日:2022-08-16
申请人: Cirque Corporation
发明人: Paul Glad , Douglas Steck
CPC分类号: G06F3/044 , B32B3/266 , B32B7/12 , B32B37/1018 , B32B37/1284 , B32B2457/208 , G06F3/03547
摘要: An apparatus may include a stack of layers, the stack including a sensor layer containing a set of electrodes and a suction opening defined through the sensor layer, and a capacitance reference surface adjacent to the sensor layer.
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公开(公告)号:US20240002033A1
公开(公告)日:2024-01-04
申请号:US17809812
申请日:2022-06-29
申请人: The Boeing Company
IPC分类号: B64C1/38 , B64G1/58 , B32B5/02 , B32B5/26 , B32B7/09 , B32B37/00 , B32B37/06 , B32B3/26 , B32B37/10
CPC分类号: B64C1/38 , B64G1/58 , B32B5/02 , B32B5/26 , B32B7/09 , B32B37/0038 , B32B37/06 , B32B3/266 , B32B37/1018 , B32B7/12
摘要: A transpirational cooling panel comprises a porous ceramic matrix composite layer and a porous high-temperature fabric layer. A machined ceramic fiber batting is located between the porous ceramic matrix composite layer and the porous high-temperature fabric layer. A ceramic stitching joins the porous ceramic matrix composite layer and the porous high-temperature fabric layer through the machined ceramic fiber batting.
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公开(公告)号:US20230321969A1
公开(公告)日:2023-10-12
申请号:US18328583
申请日:2023-06-02
发明人: OHJUNE KWON , JUCHAN KANG , DONGUN JIN , YUMHYUN HWANG
CPC分类号: B32B38/004 , B32B37/1018 , G06F1/1652
摘要: A display module manufacturing apparatus includes a stage on which a display module is disposed, a heater disposed on the stage, and configured to heat a first area of the display module, and wherein the heater includes a plurality of side surfaces and a contact surface, and a first bump controller detachably coupled to one side surface among the plurality of side surfaces and including a first bottom surface facing an upper surface of the stage. The contact surface is closer to the upper surface of the stage than the first bottom surface.
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公开(公告)号:US11774827B2
公开(公告)日:2023-10-03
申请号:US17824178
申请日:2022-05-25
申请人: E Ink Corporation
IPC分类号: G02F1/167 , B32B3/30 , B32B27/08 , B32B38/06 , B32B7/06 , B32B37/10 , G02F1/1339 , G02F1/1341 , G02F1/1335 , G02F1/1681
CPC分类号: G02F1/167 , B32B3/30 , B32B7/06 , B32B27/08 , B32B37/1018 , B32B38/06 , B32B2255/10 , B32B2255/205 , G02F1/1339 , G02F1/1341 , G02F1/133553 , G02F1/1681
摘要: A polymeric film includes a plurality of tapered microcells containing a dispersion of a first group and a second group of charged particles. The first group and second group of charged particles having opposite charge polarities. The tapered microcells include a wall and at least a portion of the wall is configured to repel the first group of charged particles. Also provided is a method of making a laminate for an electrophoretic display comprising embossing a plurality of tapered microcells through a layer of polymeric film and into a release sheet to form an embossed film; laminating the embossed film to a layer of conductive material on a protective sheet to form a laminated film; removing the release sheet from the polymeric film to form an opening to an interior of each microcell of the laminated film; filling the microcells with a dispersion fluid; and sealing the microcells.
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公开(公告)号:US20230220549A1
公开(公告)日:2023-07-13
申请号:US18123153
申请日:2023-03-17
IPC分类号: C23C16/458 , C23C16/505 , B32B37/10 , H01L21/67 , H01L21/687 , H01L21/683 , C23C16/52 , H01J37/32
CPC分类号: C23C16/4586 , C23C16/505 , B32B37/1018 , C23C16/4581 , H01L21/67103 , H01L21/68785 , H01L21/68792 , H01L21/6831 , H01L21/68757 , C23C16/52 , H01J37/32577 , B32B2457/00
摘要: A semiconductor substrate processing apparatus includes a vacuum chamber having a processing zone in which a semiconductor substrate may be processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, a showerhead module through which process gas from the process gas source is supplied to the processing zone of the vacuum chamber, and a substrate pedestal module. The substrate pedestal module includes a platen made of ceramic material having an upper surface configured to support a semiconductor substrate thereon during processing, a stem made of ceramic material having an upper stem flange that supports the platen, and a backside gas tube made of ceramic material that is located in an interior of the stem. The backside gas tube includes an upper gas tube flange that is located between a lower surface of the platen and an upper surface of the upper stem flange wherein the backside gas tube is in fluid communication with at least one backside gas passage of the platen and the backside gas tube is configured to supply a backside gas to a region below a lower surface of a semiconductor substrate that is to be supported on the upper surface of the platen during processing.
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公开(公告)号:US11691407B2
公开(公告)日:2023-07-04
申请号:US17093940
申请日:2020-11-10
发明人: Ohjune Kwon , Juchan Kang , Dongun Jin , Yumhyun Hwang
CPC分类号: B32B38/004 , B32B37/1018 , B32B2457/20 , G02B1/14 , G06F1/1607 , G06F1/1652
摘要: A display module manufacturing apparatus includes a stage on which a display module is disposed, a heater disposed on the stage, and configured to heat a first area of the display module, and wherein the heater includes a plurality of side surfaces and a contact surface, and a first bump controller detachably coupled to one side surface among the plurality of side surfaces and including a first bottom surface facing an upper surface of the stage. The contact surface is closer to the upper surface of the stage than the first bottom surface.
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公开(公告)号:US11654669B2
公开(公告)日:2023-05-23
申请号:US17376424
申请日:2021-07-15
申请人: The Boeing Company
发明人: Allen Halbritter
CPC分类号: B32B37/1018 , B29C70/342 , B29C70/44 , B29C70/443 , B29C70/544 , B29C43/3642
摘要: Systems and methods are provided for vacuum handling of composite parts. One embodiment is a method for performing vacuum securement of an object. The method includes covering the object with an impermeable membrane, locating a vacuum port at the impermeable membrane, and applying a negative pressure to the vacuum port that offsets air leaks between the impermeable membrane and the object.
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公开(公告)号:US20190184693A1
公开(公告)日:2019-06-20
申请号:US15841432
申请日:2017-12-14
申请人: The Boeing Company
CPC分类号: B32B37/1018 , B29C70/38 , B29C70/56 , B32B38/18 , B32B2605/18
摘要: An end effector transports, places and forms a composite ply on a tool having complex tool surfaces. The end effector includes a combination of vacuum and Bernoulli grippers for holding the composite ply while it is being transported and formed, and a set of mechanical actuators that form the composite ply down over the tool surfaces. The Bernoulli grippers allow the composite ply to slip while being held and formed.
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