公开(公告)号：US12097794B2

公开(公告)日：2024-09-24

申请号：US17198996

申请日：2021-03-11

Applicant: Ford Global Technologies, LLC

Inventor： Stuart C. Salter ,  David Brian Glickman ,  Peter Phung ,  Paul Kenneth Dellock ,  Pietro Buttolo ,  John Robert Van Wiemeersch

IPC: B60P1/43 ,  B32B3/12 ,  B32B5/02 ,  B32B37/00 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B37/14 ,  B32B37/24 ,  B32B38/00 ,  B32B38/08

CPC classification number: B60P1/433 ,  B32B3/12 ,  B32B5/02 ,  B32B37/0076 ,  B32B37/06 ,  B32B37/10 ,  B32B37/146 ,  B32B38/08 ,  B32B2037/1253 ,  B32B2037/243 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2317/18 ,  B32B2375/00 ,  B32B2605/00

Abstract: A load ramp for a vehicle includes a corrugated layer that has a first surface and a second surface. A first layer is positioned adjacent to the first surface of the corrugated layer. A second layer is positioned adjacent to the second surface of the corrugated layer such that the corrugated layer is positioned between the first and second layers. A thickness of the load ramp can be in the range of about 10 mm to about 30 mm. A load capacity of the load ramp can be at least about 100 kg. A method of manufacturing the load ramp is also disclosed.

公开(公告)号：US20240301243A1

公开(公告)日：2024-09-12

申请号：US18564846

申请日：2022-05-30

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Shinji KAWADA ,  Tomoki TODA ,  Shuuji KAGE ,  Chiharu OKUHARA ,  Kaito NEMOTO

IPC: C09J4/00 ,  B32B7/12 ,  B32B37/12 ,  C08F220/18 ,  C08F220/28 ,  C09J5/00 ,  C09J133/06 ,  C09J133/14

CPC classification number: C09J4/00 ,  B32B7/12 ,  B32B37/1284 ,  C08F220/1809 ,  C08F220/1811 ,  C08F220/282 ,  C09J5/00 ,  C09J133/062 ,  C09J133/14 ,  B32B2037/1253 ,  B32B2255/26 ,  B32B2307/558 ,  B32B2307/748 ,  C08F2810/20 ,  C09J2433/00

Abstract: The present invention aims to provide a UV-curable composition having excellent printability, excellent UV reactivity in the presence of oxygen, and excellent adhesiveness at room temperature and high temperature. Provided is a UV-curable composition containing: a curing component containing a (meth)acrylate monomer and a crosslinking component; and a UV curing agent, the (meth)acrylate monomer including, in 100% by weight of the curing component, 50 to 85% by weight of a monomer that, in a form of a homopolymer, has a glass transition temperature of −70° C. to −30° C., a cured product being obtained by applying the composition to a substrate at a thickness of 150 μm and irradiating the composition, without sealing an upper surface of the applied composition, with UV light having a wavelength of 315 nm to 480 nm at an irradiance of 90 mW/cm2 and a dose of 1,350 mJ/cm2 in an atmospheric environment, the cured product having a gel fraction of 0.4 to 78%, a glass transition temperature of −35° C. to 10° C., a reaction percentage of 83% or higher, and a reaction progress percentage on a surface facing the atmosphere of 93% or higher relative to a surface facing the substrate.

公开(公告)号：US20240294804A1

公开(公告)日：2024-09-05

申请号：US18605534

申请日：2024-03-14

Applicant: Henkel AG & Co. KGaA

Inventor： Michael Doherty ,  Brian Deegan ,  Stephen Fearon ,  David Condron ,  Barry Burns

IPC: C09J5/02 ,  B32B37/12 ,  C09J133/04

CPC classification number: C09J5/02 ,  B32B37/1284 ,  C09J133/04 ,  B32B2037/1253 ,  B32B2309/04 ,  B32B2310/0831 ,  B32B2310/0837 ,  B32B2311/30 ,  B32B2457/00 ,  C09J2433/00

Abstract: A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising:



(a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface;
(b) activating the primed bonding surface of the first substrate by exposing the primed bonding surface to actinic radiation;
(c) applying, to the so activated bonding surface of the first substrate, and/or or to the bonding surface of the second substrate, a UV curable anaerobic adhesive;
(d) mating the bonding surfaces together with the UV curable anaerobic adhesive therebetween; and
(e) exposing the UV curable anaerobic adhesive between the mated surfaces to actinic UV radiation. The method is particularly suited for obtaining bonds with good tensile shear strength with electrical substrates coated with an insulating varnish.

公开(公告)号：US20240294004A1

公开(公告)日：2024-09-05

申请号：US18601958

申请日：2024-03-11

Applicant: Parallel Wireless, Inc.

Inventor： Brandon Kent ,  Adam Meunier ,  Michael Papa

IPC: B32B29/00 ,  B32B7/12 ,  B32B37/08 ,  B32B37/12 ,  B32B37/20 ,  B32B38/00

CPC classification number: B32B29/005 ,  B32B7/12 ,  B32B37/08 ,  B32B37/1207 ,  B32B37/20 ,  B32B38/1875 ,  B32B2037/1253 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/7375 ,  B32B2307/75 ,  B32B2309/02 ,  B32B2317/12

Abstract: A method of manufacturing double-sided thermally-printable ballot stock is disclosed, comprising: receiving a first and a second input roll of paper having a thermo-sensitive ink layer and a base paper layer and emitting a first web; tension evening of the first and second web using festooning rollers; applying an adhesive in a liquid state using anilox rollers to the base paper layer of the first web; laminating the first web and the second web through laminating rollers, with the base paper layer of the first web contacting the base paper layer of the second web using the adhesive to create a laminated output web; heating the laminated output web to cure the adhesive in an oven while moving the laminated output web through the oven; and reducing a temperature of the applied liquid adhesive in the laminated output web.

公开(公告)号：US20240286398A1

公开(公告)日：2024-08-29

申请号：US18645650

申请日：2024-04-25

Applicant: ENTEGRIS, INC.

Inventor： Chiranjeevi PYDI ,  Nathan RICHARD ,  Steven DONNELL ,  Sara MERCHEL ,  Caleb MINSKY ,  Cerel MUNOZ ,  Yan LIU

IPC: B32B41/00 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  B32B37/08 ,  B32B37/12 ,  H01L21/683

CPC classification number: B32B41/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B37/08 ,  B32B37/12 ,  B32B2037/1253 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/60 ,  B32B2309/72 ,  B32B2311/24 ,  B32B2315/02 ,  B32B2457/00 ,  H01L21/6831

Abstract: Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.

公开(公告)号：US20240243394A1

公开(公告)日：2024-07-18

申请号：US18585881

申请日：2024-02-23

Applicant: SHOWA DENKO PACKAGING CO., LTD.

Inventor： Wei HE ,  Hiroaki ITO ,  Takashi NAGAOKA ,  Makoto KARATSU

IPC: H01M50/124 ,  B32B1/08 ,  B32B7/027 ,  B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/16 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/02 ,  B32B37/06 ,  B32B37/12 ,  B32B37/24 ,  H01M10/052 ,  H01M10/0525 ,  H01M50/119 ,  H01M50/121 ,  H01M50/129 ,  H01M50/131

CPC classification number: H01M50/124 ,  B32B1/08 ,  B32B7/027 ,  B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/16 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/02 ,  B32B37/06 ,  B32B37/12 ,  H01M10/0525 ,  H01M50/119 ,  H01M50/121 ,  H01M50/129 ,  H01M50/131 ,  B32B2037/1253 ,  B32B2037/243 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/31 ,  B32B2307/50 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7244 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2307/736 ,  B32B2307/738 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2311/24 ,  B32B2333/04 ,  B32B2375/00 ,  B32B2377/00 ,  B32B2439/00 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2457/10 ,  B32B2553/00 ,  B32B2605/00 ,  H01M10/052 ,  H01M2220/10 ,  H01M2220/20 ,  H01M2220/30

Abstract: The packaging material includes a heat-resistant resin layer 2 as an outer side layer, a heat-fusible resin layer 3 as an inner side layer, and a metal foil layer 4 arranged between these layers. The heat-resistant resin layer 2 is made of a heat-resistant resin film having a hot water shrinkage rate of 1.5% to 12% and the heat-resistant resin layer 2 and the metal foil layer 4 are adhered via an outer side adhesive layer 5. The adhesive layer 5 is formed by an urethane adhesive agent containing a polyol, a polyfunctional isocyanate compound, and an aliphatic compound containing a plurality of functional groups capable of reacting with an isocyanate group in one molecule. With this, a packaging material can be provided in which excellent formability can be secured and delamination can be sufficiently suppressed without causing pinholes, etc., even when deep depth drawing is performed.

公开(公告)号：US20240217201A1

公开(公告)日：2024-07-04

申请号：US18561744

申请日：2021-05-25

Applicant: Mitsubishi Electric Corporation

Inventor： Ichiya TAKAHASHI ,  Shigeru UTSUMI

IPC: B32B3/12 ,  B32B7/12 ,  B32B37/12 ,  B32B38/00

CPC classification number: B32B3/12 ,  B32B7/12 ,  B32B37/12 ,  B32B2037/1253 ,  B32B2038/0076 ,  B32B2305/024 ,  B32B2305/72

Abstract: A ribbon laminated body (1) used for creating a honeycomb core is constituted by a plurality of layers of ribbons (2) laminated, a low-temperature curing adhesion portion, and a high-temperature curing adhesion portion. Between each two adjacent ribbons (2), there exist a low-temperature curing adhesion portion that adhesively bonds the both ribbons (2), which is in contact with the both ribbons (2), and a high-temperature curing adhesion portion that is in contact with the both ribbons (2). At a portion where the low-temperature curing adhesion portion is in contact with a ribbon (2), the shape of the low-temperature curing adhesion portion is a trapezoidal shape, wherein an upper base is overlapped with a part of one long side of the ribbon (2), and a lower base is overlapped with a part of the other long side of the ribbon (2). At a portion where the high-temperature curing adhesion portion is in contact with the ribbon (2), a part of a periphery of the high-temperature curing adhesion portion is in contact with one oblique side of two oblique sides included in one of low-temperature curing adhesion portions.

公开(公告)号：US11999882B2

公开(公告)日：2024-06-04

申请号：US17328318

申请日：2021-05-24

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Ho Jung ,  Wonjin Kim

IPC: C09J7/24 ,  B32B7/12 ,  B32B37/12 ,  C09J7/25 ,  H01L51/52 ,  H01L51/56 ,  H10K50/84 ,  H10K71/00 ,  H10K102/00

CPC classification number: C09J7/243 ,  B32B7/12 ,  B32B37/1284 ,  C09J7/255 ,  H10K50/841 ,  H10K71/00 ,  B32B2037/1253 ,  B32B2457/206 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2467/006 ,  H10K2102/311

Abstract: A display device in which a curved area having a curved shape and a straight area having a planar shape are defined includes a display panel including a first curved portion overlapping the curved area and a first straight portion overlapping the straight area, a window disposed on the display panel and including a second curved portion overlapping the curved area and a second straight portion overlapping the straight area, and an adhesive layer disposed between the display panel and the window. The adhesive layer includes a first adhesive layer disposed between the first and second straight portions and couples the first straight portion to the second straight portion, and a second adhesive layer disposed in a first space between the first curved portion and the second curved portion and a second space between the first adhesive layer and the second straight portion.

公开(公告)号：US11981841B2

公开(公告)日：2024-05-14

申请号：US16616983

申请日：2019-08-07

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventor： Mingjun Zhou

IPC: C09J7/10 ,  B32B37/04 ,  B32B37/12

CPC classification number: C09J7/10 ,  B32B37/04 ,  B32B37/1292 ,  B32B2037/1253 ,  B32B2457/20 ,  C09J2427/00 ,  C09J2431/00 ,  C09J2433/00 ,  C09J2477/00 ,  C09J2481/00

Abstract: A sealant structure and a method of fabricating a display panel are provided. The sealant structure includes a plurality of adhesive strips, and the adhesive strips overlap end to end to form a closed loop. Ends of at least one of any two adjacent adhesive strips are provided with an overlap region, and a width of the overlap region is less than or equal to one third of a width of the adhesive strip provided with the overlap region.

公开(公告)号：US11945984B2

公开(公告)日：2024-04-02

申请号：US16650764

申请日：2018-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Takeshi Nakano ,  Keiji Hayashi ,  Souya Jo ,  Shogo Sasaki ,  Kenichi Kataoka

IPC: C09J7/38 ,  B32B37/12 ,  C09J133/06 ,  C09J133/08 ,  B32B27/26 ,  B32B27/30

CPC classification number: C09J7/385 ,  B32B37/12 ,  C09J133/066 ,  C09J133/08 ,  B32B27/26 ,  B32B27/30 ,  B32B2037/1253 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/542 ,  B32B2405/00 ,  B32B2457/20 ,  C09J2433/00 ,  C09K2323/057 ,  C08F220/1804 ,  C08F226/10 ,  C08F220/20 ,  C08F220/14 ,  C08F220/1808 ,  C08F220/14 ,  C08F220/20 ,  C08F220/1804 ,  C08F220/06

Abstract: A reinforcing film comprises a pressure sensitive adhesive layer laminated and fixed on a principal surface of a film substrate. The pressure sensitive adhesive layer is formed of a photocurable composition containing a photocurable agent and a base polymer having a crosslinked structure. The gel fraction of the photocurable composition is preferably 60% or more. The shear storage elastic modulus at 25° C. of the pressure sensitive adhesive layer is preferably 1×104 to 1.2×105 Pa. The shear storage elastic modulus at 25° C. of the pressure sensitive adhesive layer after photocuring is preferably 1.5×105 to 2×106 Pa.