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公开(公告)号：US20170266940A1
公开(公告)日：2017-09-21
申请号：US15233048
申请日：2016-08-10
发明人： Fuyi CUI , Xu CHEN , Quanqin SUN , Zhiqiang GAO , Jingjing CHEN
CPC分类号： B32B37/02 , B32B37/10 , B32B37/12 , B32B37/26 , B32B38/0036 , B32B2307/20 , B32B2307/40 , B32B2309/12 , B32B2457/20
摘要： An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.
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公开(公告)号：US20190143670A1
公开(公告)日：2019-05-16
申请号：US16039584
申请日：2018-07-19
发明人： Jingjing CHEN , Xuefei BAI , Xuansheng WANG , Yedong WANG
摘要： The present disclosure provides a screen printing device, including a printing screen having a printing mesh and a mesh frame, and a squeegee blade, wherein the printing mesh has first and second longitudinal ends, first and second blank areas, and a printing portion with printed patterns between the first and second blank areas, which being movably connected to the mesh frame by a tension adjusting mechanism respectively and being provided with at least one tension sensor respectively approximate to the printing portion, wherein the device further has a control means for receiving a tension measurement value from the tension sensor and compare it with a reference value so as to control the tension adjustment mechanism to adjust the tension in the printing mesh. The disclosure further provides a method for adjusting the tension of the printing mesh of the screen printing device.
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公开(公告)号：US20180354286A1
公开(公告)日：2018-12-13
申请号：US15736730
申请日：2017-06-16
发明人： Jingjing CHEN , Lina WANGL , Liang ZHANG , Defu ZHANG , Fuyi CUI
摘要： Described is a printing method comprising: forming an organic material layer on a non-printing region of a substrate, the burning point of the organic material layer being lower than the pre-curing temperature of glass glue; performing printing processing on the substrate so as to form the glass glue on a printing region of the substrate; and performing a burning processing of the organic material layer so as to separate the organic material layer from the substrate. Such a printing method can effectively avoid the occurrence of the printing offset and burrs and thus greatly reduce the rate of defective goods.
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4.发明申请公开(公告)号：US20180212206A1
公开(公告)日：2018-07-26
申请号：US15538261
申请日：2016-09-27
发明人： Bing LI , Ang XIAO , Fuyi CUI , Jingjing CHEN , Xueyong ZHANG , Dan JIA , Lina WANG
CPC分类号： H01L51/56 , H01J9/261 , H01L27/3241 , H01L51/524
摘要： The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.
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