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公开(公告)号：US20220262891A1
公开(公告)日：2022-08-18
申请号：US17630631
申请日：2021-04-29
发明人： Shuang LIANG , Muxin DI , Zhiwei LIANG , Ke WANG , Zhanfeng CAO , Yingwei LIU
IPC分类号： H01L27/32
摘要： Disclosed are a connecting substrate and a fabrication method, a splicing screen, and a display apparatus. The connecting substrate has panel areas (10) and connecting areas (30) connecting every two adjacent panel areas (10), each panel area including a display area (20) surrounded by the connecting areas (30). The connecting substrate includes, in connecting area: a base (101); connecting wirings (102) on the base (101); an insulating layer (103) covering the plurality of connecting wirings (102) and defining a groove (106) for accommodating a display panel (107) to be spliced; through holes (105) penetrating the insulating layer (103); and connecting electrodes (104) respectively provided in the through holes (105) and coupled to the connecting wirings (102) in one-to-one correspondence. The connecting electrodes (104) are coupled to first pads (P1) on light-emitting surface of the display panel (107) to be spliced in one-to-one correspondence.
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公开(公告)号：US20210408168A1
公开(公告)日：2021-12-30
申请号：US16605493
申请日：2019-04-28
发明人： Shuang LIANG , Yingwei LIU , Zhanfeng CAO , Zhiwei LIANG , Muxin DI
IPC分类号： H01L27/32 , H01L41/113
摘要： Disclosed herein is a photoelectric sensor, display panel and their manufacturing method. The photoelectric sensor may comprise a photodeformable unit and a piezoelectric unit in contact with the photodeformable unit.
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公开(公告)号：US20210066538A1
公开(公告)日：2021-03-04
申请号：US16918753
申请日：2020-07-01
发明人： Yingwei LIU , Zhiwei LIANG , Ke WANG , Zhanfeng CAO , Shuang LIANG
摘要： A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.
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公开(公告)号：US20220223775A1
公开(公告)日：2022-07-14
申请号：US17615075
申请日：2020-11-04
发明人： Yingwei LIU , Zhanfeng CAO , Zhiwei LIANG , Ke WANG , Muxin DI , Shuang LIANG , Yankai GAO
IPC分类号： H01L33/62 , H01L33/00 , H01L33/38 , H01L25/075 , G09F9/302
摘要： A method of manufacturing a driving backplane for display includes: forming a first conductive pattern layer including first conductive lines on a base; and forming a second conductive pattern layer including electrode groups and second conductive lines on a side of the first conductive pattern layer away from the base. The first conductive lines and the second conductive lines cross and are insulated from each other; an electrode group includes a first electrode and a second electrode electrically connected to a corresponding second conductive line. Orthogonal projections, on the base, of the first electrode and a corresponding first conductive line have an overlapping region, and a portion of the first electrode, whose orthogonal projection on the base is located in the overlapping region, is in contact with a portion of the first conductive line, whose orthogonal projection on the base is located in the overlapping region.
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公开(公告)号：US20210043619A1
公开(公告)日：2021-02-11
申请号：US16920771
申请日：2020-07-06
发明人： Yingwei LIU , Ke WANG , Zhiwei LIANG , Muxin DI , Zhanfeng CAO , Shuang LIANG , Guangcai YUAN , Qi YAO , Dongni LIU
IPC分类号： H01L25/18 , H01L23/538 , H01L23/00 , H01L25/00
摘要： Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.
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公开(公告)号：US20230060979A1
公开(公告)日：2023-03-02
申请号：US17800236
申请日：2021-05-14
发明人： Zhiwei LIANG , Zhanfeng CAO , Ke WANG , Yingwei LIU , Shunyu YAO , Shuang LIANG , Muxin DI
摘要： A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.
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公开(公告)号：US20210210522A1
公开(公告)日：2021-07-08
申请号：US16650690
申请日：2019-10-08
发明人： Yingwei LIU , Shuang LIANG , Zhiwei LIANG , Muxin DI , Ke WANG , Zhanfeng CAO
IPC分类号： H01L27/12 , H01L25/16 , H01L25/065
摘要： The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.
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