公开(公告)号：US20230060979A1

公开(公告)日：2023-03-02

申请号：US17800236

申请日：2021-05-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Zhanfeng CAO ,  Ke WANG ,  Yingwei LIU ,  Shunyu YAO ,  Shuang LIANG ,  Muxin DI

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38 ,  G09G3/32

Abstract: A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.