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公开(公告)号:US20210225972A1
公开(公告)日:2021-07-22
申请号:US16099499
申请日:2017-09-29
Inventor: Lianjie Qu , Xiaogai Chun , Xue Gao , Hebin Zhao , Guangdong Shi , Shuai Liu , Yonglian Qi , Bingqiang Gui
IPC: H01L27/32
Abstract: The present application discloses an array substrate, a display apparatus and a method of fabricating an array substrate. The array substrate has a plurality of first bottom-gate type thin film transistors each of which including a metal oxide active layer and a plurality of second bottom-gate type thin film transistors each of which including a silicon active layer.
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公开(公告)号:US11233106B2
公开(公告)日:2022-01-25
申请号:US16099499
申请日:2017-09-29
Inventor: Lianjie Qu , Xiaogai Chun , Xue Gao , Hebin Zhao , Guangdong Shi , Shuai Liu , Yonglian Qi , Bingqiang Gui
IPC: H01L27/32
Abstract: The present application discloses an array substrate, a display apparatus and a method of fabricating an array substrate. The array substrate has a plurality of first bottom-gate type thin film transistors each of which including a metal oxide active layer and a plurality of second bottom-gate type thin film transistors each of which including a silicon active layer.
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公开(公告)号:US10050151B2
公开(公告)日:2018-08-14
申请号:US15276339
申请日:2016-09-26
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jing Niu , Xiaogai Chun
Abstract: A dual-gate TFT array substrate and manufacturing method thereof and a display device are provided. The manufacturing method includes: forming a common electrode and a top-gate electrode through one patterning process. The manufacturing method reduces the times of patterning process and simplifies the process flow.
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公开(公告)号:US20170213916A1
公开(公告)日:2017-07-27
申请号:US15276339
申请日:2016-09-26
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jing Niu , Xiaogai Chun
IPC: H01L29/786 , H01L29/66 , H01L27/12
CPC classification number: H01L29/7869 , H01L27/1225 , H01L27/124 , H01L27/1262 , H01L27/1288 , H01L29/66969 , H01L29/78648
Abstract: A dual-gate TFT array substrate and manufacturing method thereof and a display device are provided. The manufacturing method includes: forming a common electrode and a top-gate electrode through one patterning process. The manufacturing method reduces the times of patterning process and simplifies the process flow.
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