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公开(公告)号：US20170265341A1
公开(公告)日：2017-09-14
申请号：US15233995
申请日：2016-08-11
发明人： Yusheng Ke , Yanping Li , Jiali Wang , Junjun Liu , Yun Wang , Xinwei Huang
IPC分类号： H05K13/00
CPC分类号： H05K13/0092 , H01R12/79 , H01R43/0242 , H05K3/361 , H05K2203/163
摘要： An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and/or the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. Thereby, aforementioned design with heat dissipation slots and/or heat dissipation holes solve a problem of uneven surface temperatures of the crimping tool tip caused by a transmission of most of the heat generated by the heating rod, directing towards a central position of the crimping tool tip, such that a uniformity of surface temperatures of the crimping tool tip is ensured to control a temperature difference between both left and right ends and a central portion of a lower surface of the crimping tool tip to be constrained within 10° C. so as to offer guarantee for a uniformity of reactions of the conductive adhesive, resulting in an enhanced crimping quality.
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公开(公告)号：US10264718B2
公开(公告)日：2019-04-16
申请号：US15233995
申请日：2016-08-11
发明人： Yusheng Ke , Yanping Li , Jiali Wang , Junjun Liu , Yun Wang , Xinwei Huang
摘要： An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof.
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