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公开(公告)号：US20170265341A1
公开(公告)日：2017-09-14
申请号：US15233995
申请日：2016-08-11
发明人： Yusheng Ke , Yanping Li , Jiali Wang , Junjun Liu , Yun Wang , Xinwei Huang
IPC分类号： H05K13/00
CPC分类号： H05K13/0092 , H01R12/79 , H01R43/0242 , H05K3/361 , H05K2203/163
摘要： An external-leadwire crimping apparatus is provided by embodiments of the present invention, including: a heating base provided with a heating rod and a temperature sensor; a crimping tool tip which is connected with the heating base and supplied with heat from the heating base, the crimping tool tip being configured to to crimp a leadwire of a flexible printed circuit board onto a printed circuit board assembly, by curing a conductive adhesive after receipt of heat, and the crimping tool tip comprising a crimping tool tip body. The crimping tool tip body is provided with at least one heat dissipation slot on an upper surface thereof, the heat dissipation slot being configured to extend in a thickness direction of the crimping tool tip body and to penetrate therethrough at both ends; and/or the crimping tool tip body is provided with at least one heat dissipation hole penetrating the thickness direction thereof. Thereby, aforementioned design with heat dissipation slots and/or heat dissipation holes solve a problem of uneven surface temperatures of the crimping tool tip caused by a transmission of most of the heat generated by the heating rod, directing towards a central position of the crimping tool tip, such that a uniformity of surface temperatures of the crimping tool tip is ensured to control a temperature difference between both left and right ends and a central portion of a lower surface of the crimping tool tip to be constrained within 10° C. so as to offer guarantee for a uniformity of reactions of the conductive adhesive, resulting in an enhanced crimping quality.
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公开(公告)号：US20070155205A1
公开(公告)日：2007-07-05
申请号：US11324836
申请日：2006-01-03
申请人： Donald Harper
发明人： Donald Harper
IPC分类号： H01R13/44
CPC分类号： H01R43/205 , H01R43/0242 , H01R43/0249 , H01R43/0256 , H01R43/0263
摘要： An improved pickup cap may be provided with a surface area configuration that imparts a more even temperature distribution across the ball grid array during reflow. The pickup cap, when connected to the electrical connector, may cover the sides of the electrical connector, but not cover the central portion of the electrical connector. Such a configuration of pickup cap surface areas may provide a more even temperature distribution across the grid of solder balls during reflow of the solder balls.
摘要翻译： 可以提供改进的拾取盖，其具有表面区域配置，其在回流期间在球栅阵列上赋予更均匀的温度分布。 拾取盖当连接到电连接器时可以覆盖电连接器的侧面，但不覆盖电连接器的中心部分。 拾取盖表面区域的这种构造可以在焊球回流期间在焊球的网格上提供更均匀的温度分布。
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公开(公告)号：US07134201B2
公开(公告)日：2006-11-14
申请号：US10987469
申请日：2004-11-12
IPC分类号： H01R43/00
CPC分类号： H01R43/0207 , H01R13/03 , H01R43/0242 , H01R43/0263 , H01R2201/26 , Y10T29/49117 , Y10T29/49147 , Y10T29/49155 , Y10T29/49174
摘要： A method of bonding a connector to an electrical conductor. The conductor is applied to a glass substrate and the connector is placed over the conductor. An ultrasonic welding apparatus is used to oscillate the connector relative to the conductor to bond the connector to the conductor while maintaining the temperatures of the connector and conductor below the predefined melting points and without damaging the glass substrate. In addition, an electrically conductive foil can be disposed between the connector and the conductor for ensuring electrical communication between the connector and the conductor.
摘要翻译： 将连接器接合到电导体的方法。 将导体施加到玻璃基板上，并将连接器放置在导体上。 使用超声波焊接装置来相对于导体振荡连接器，以将连接器连接到导体，同时将连接器和导体的温度保持在预定熔点以下并且不会损坏玻璃基板。 此外，可以在连接器和导体之间设置导电箔，以确保连接器和导体之间的电连通。
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公开(公告)号：US20060073743A1
公开(公告)日：2006-04-06
申请号：US11244871
申请日：2005-10-06
申请人： Tim Ford , Barry Reis
发明人： Tim Ford , Barry Reis
IPC分类号： H01R4/10
CPC分类号： H01R4/187 , H01R43/0228 , H01R43/0242 , H01R43/05
摘要： A machine that will remove the lacquer type of insulation in the region of the crimp of a terminal without requiring the terminal connector to be moved. The machine can use any type of terminal connector that has at least one wire having this type of insulation. The machine will improve upon mechanical connection as a result of heating the terminal in the region of the legs of the crimp, which can in some cases actually weld the wire to the terminal. A terminal connector that has an improved connection between the wire and the terminal without the need for skiving the terminal in order to remove the lacquer type of insulation is also disclosed. The invention can be adapted to use any wire type combination of insulated wires provided at least one wire is coated with a lacquer type of insulating material. The terminal connector is otherwise a standard type except for the connection improvement in the region of the crimp.
摘要翻译： 这种机器能够在端子连接器移动的情况下去除端子的压接区域中的漆类绝缘体。 该机器可以使用具有至少一根具有这种绝缘类型的导线的任何类型的端子连接器。 该机器将通过加热端子在压接腿的区域中的机械连接而改进，这在某些情况下实际上可以将导线焊接到端子。 还公开了一种端子连接器，其具有改进的导线与端子之间的连接，而不需要对端子进行切割以除去漆类绝缘体。 本发明可以适用于使用提供至少一根线的绝缘电线的任何导线类型的组合，其涂覆有漆类型的绝缘材料。 除了压接区域中的连接改进之外，端子连接器是标准型。
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公开(公告)号：US20050284654A1
公开(公告)日：2005-12-29
申请号：US11214351
申请日：2005-08-29
申请人： Bunya Sato
发明人： Bunya Sato
IPC分类号： H01R43/16 , H01R4/02 , H01R43/02 , H05K1/11 , H05K1/18 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/20
CPC分类号： H01R43/0242 , H01R4/02 , H05K3/328 , H05K3/341 , H05K3/4015 , H05K2201/062
摘要： A composite board is fixed by solder to an electrode land formed on a circuit board having an electric wiring. The composite board and another metal plate are bonded by using an electric welding method or the like. By bonding a metal plate of a low resistance or a non-metal plate to the composite board, heat of high temperature or a large current which is generated upon electric wiring can be made difficult to be transferred to a lower portion of the composite board. A structure of a terminal member in which it is possible to prevent the solder under the composite board from being diffused, the solder is not scattered to the periphery, and a short-circuit is not caused is obtained. The terminal member to form the circuit board which is more mechanically and electrically stable is provided.
摘要翻译： 复合板通过焊料固定到形成在具有电布线的电路板上的电极焊盘。 复合板和另一金属板通过电焊方法等粘合。 通过将低电阻金属板或非金属板的金属板接合到复合板，可以使得难以将高温或在电线上产生的大电流传递到复合板的下部。 可以防止复合板下方的焊料扩散的端子构件的结构，焊料不会散射到周围，并且不产生短路。 提供了更机械和电气稳定的形成电路板的端子构件。
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公开(公告)号：US5908568A
公开(公告)日：1999-06-01
申请号：US836531
申请日：1997-05-02
申请人： Michael Dittmann , Erich Vojta
发明人： Michael Dittmann , Erich Vojta
CPC分类号： H01R43/0242 , B23K1/0008 , H01F41/10 , H01R4/023 , B23K2201/38
摘要： A connecting pin of a coil, which has an end section with an end section of a winding wire wound thereon with a plurality of turns, is initially provided with a drop of a fluxless soft solder and then arranged in the vicinity of the points of two opposite electrodes. An arc of a specific strength and duration is struck between the electrodes, so that the soft solder is fused and connects the winding wire to the connecting pin. The result is a fluxless soldering of the winding end in conjunction with low thermal loading of the coil former and of the connecting pin.
摘要翻译： PCT No.PCT / DE95 / 01527 Sec。 371日期：1997年5月2日 102（e）日期1997年5月2日PCT提交1995年11月3日PCT公布。 公开号WO96 / 14647 日期1996年5月17日具有卷绕在其上的绕组线的端部具有多个匝的线圈的连接销最初设置有一滴无助焊剂软焊料，然后设置在 两个相对电极的点。 在电极之间产生特定的强度和持续时间的电弧，使软焊料熔化并将绕组线连接到连接销上。 结果是绕组端的无焊剂焊接以及线圈架和连接销的低热负荷。
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公开(公告)号：US5032702A
公开(公告)日：1991-07-16
申请号：US416689
申请日：1989-10-03
申请人： James P. Scholz
发明人： James P. Scholz
CPC分类号： H01R4/723 , B23K3/0475 , H01R43/0242 , H05B3/12
摘要： A tool for use in soldering a single termination of a wire end to a terminal solder tail or other wire end within a dielectric sleeve enclosing a solder preform, and in desoldering a single existing termination needing repair, includes an arcuate tip shaped to be placed against the outside surface of the dielectric sleeve. A substrate of bipartite metal foil is secured along the inner arcuate surface of the formed dielectric tip and has a first layer of conductive metal such as copper and a thin second layer of high resistance second metal having high magnetic permeability such as nickel-iron alloy. When a constant amplitude high frequency alternating current is conducted through the foil, the foil generates thermal energy until achieving a known maximum temperature. For soldering to form a termination, the thermal energy is transmitted to the adjacent sleeve melting the solder of the preform therewithin to join the conductors in the sleeve. For desoldering the thermal energy is transmitted through the sleeve to remelt the solder of the termination, after which the conductors are pulled apart. The tool can have replaceable tips of different shapes and sizes; each tip has embedded wire portions extending from foil ends to a pair of contacts at the mounting end matable with contacts in the tool handle to connect to the cables of the current source.
摘要翻译： 用于将线端的单个终端焊接到封装焊料预制件的电介质套筒内的端子焊尾或其它线端以及拆焊单个现有终端需要修复的工具，包括弓形尖端，其被成形为抵抗 电介质套管的外表面。 二极金属箔的基板沿着形成的电介质末端的内弧形表面固定，并且具有诸如铜的第一导电金属层和具有高磁导率的高电阻第二金属的第二层，例如镍 - 铁合金。 当通过箔片传导恒定幅度的高频交流电时，箔片产生热能，直到达到已知的最高温度。 为了焊接以形成终端，热能传递到相邻的套筒，熔化预成型件的焊料以使套管中的导体接合。 为了拆焊，热能通过套筒传输，以重新熔化端子的焊料，然后将导体拉开。 该工具可以具有不同形状和尺寸的可替换的尖端; 每个尖端具有从箔端部延伸到在安装端处的一对触点的嵌入的线部分，其与工具手柄中的触点配合以连接到电流源的电缆。
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公开(公告)号：US08701966B2
公开(公告)日：2014-04-22
申请号：US13749645
申请日：2013-01-24
申请人： Apple Inc.
发明人： Michael Nikkhoo , Amir Salehi
CPC分类号： H01R43/0242 , B23K1/0016 , B23K3/00 , B23K3/0475 , H01R12/53 , H01R43/0207 , H01R43/0249 , H05K3/3405 , H05K3/3494 , H05K13/0015 , H05K2201/094 , H05K2201/10287 , H05K2201/10356 , H05K2203/101 , Y10T29/49179
摘要： The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
摘要翻译： 所描述的实施例一般涉及感性接合领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了用于成形磁场的多种方法，用于完成感应接合工艺而不对非屏蔽的相邻电气部件造成伤害。
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公开(公告)号：US20130186941A1
公开(公告)日：2013-07-25
申请号：US13749645
申请日：2013-01-24
申请人： Apple Inc.
发明人： Michael Nikkhoo , Amir Salehi
IPC分类号： H05K13/00
CPC分类号： H01R43/0242 , B23K1/0016 , B23K3/00 , B23K3/0475 , H01R12/53 , H01R43/0207 , H01R43/0249 , H05K3/3405 , H05K3/3494 , H05K13/0015 , H05K2201/094 , H05K2201/10287 , H05K2201/10356 , H05K2203/101 , Y10T29/49179
摘要： The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.
摘要翻译： 所描述的实施例一般涉及感性接合领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了用于成形磁场的多种方法，用于完成感应接合工艺而不对非屏蔽的相邻电气部件造成伤害。
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公开(公告)号：US07422913B2
公开(公告)日：2008-09-09
申请号：US10852007
申请日：2004-05-24
申请人： Min-Rei Jiang
发明人： Min-Rei Jiang
CPC分类号： G01K11/12 , H01R12/7076 , H01R43/0242 , H05K1/0269 , H05K3/3494 , H05K2203/161 , H05K2203/163
摘要： A method for connecting terminals is provided. The method includes steps of a) providing a board having a first terminal thereon; b) performing a check of a heat treatment by using a thermal sensitive paper in order to determine a optimal condition of the heat treatment for the board; c) heating the first terminal under the optimal condition of the heat treatment; and d) connecting a second terminal to the heated first terminal.
摘要翻译： 提供了一种用于连接端子的方法。 该方法包括以下步骤：a）提供其上具有第一端子的板; b）通过使用热敏纸进行热处理检查，以确定板的热处理的最佳状态; c）在热处理的最佳条件下加热第一端子; 以及d）将第二端子连接到被加热的第一端子。
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