公开(公告)号：US20190202188A1

公开(公告)日：2019-07-04

申请号：US16322682

申请日：2017-02-08

Applicant: BOSTIK, INC.

Inventor： Steven Daniel GRAY ,  Ronald Frank GRAF ,  David Frederic FREUND ,  Miao HU ,  Russell P. STUCZYNSKI ,  Richard Edward HAMANN ,  Jeffery Thomas OLSON

IPC: B32B37/00 ,  B32B37/12 ,  B32B7/12 ,  B32B5/02 ,  B32B27/32 ,  B32B38/00 ,  B32B37/06 ,  B32B37/02 ,  B32B37/18

CPC classification number: C09J5/06 ,  B32B7/12

Abstract: Adhesive bleed-through of substrates and build-up of adhesive on process equipment can be reduced or even fully eliminated by increasing the running temperature of circumferential rolls (e.g., nip rollers or idlers) used to compress and adhesively bond the substrates of a laminate structure together, as opposed to the usual cooling of the nip rollers. This method is particularly beneficial when using polyolefin-based hot melt adhesives to form laminates with permeable substrates, such as low basis weight nonwovens, for use in disposable absorbent articles. The method can be used to make a range of laminated structures, such as bi-laminates and tri-laminates.