Abstract:
A combined component and interconnection module having a plurality of components, such as integrated circuit modules, directly mounted to and electrically connected with an interconnection pattern so as to avoid the need for the conventional printed circuit board or other external means normally required to provide interconnections between these components. The interconnection pattern is formed using computercontrolled winding apparatus to form wire loops in predetermined slots of a core in a predetermined sequence, the wire loops on one side of the core being cut to permit the remaining loops to provide the desired interconnection pattern. The components of the combined module are mechanically and electrically connected to the core and interconnection pattern by component terminals which pass into respect core slots for soldering to loop wire portions therein. Selected component terminals also may be advantageously adapted to serve as output terminals for the resulting combined module. Power busses may additionally be incorporated within the combined module. A number of advantageous assemblies for these combined modules are also disclosed.