公开(公告)号：US20160264100A1

公开(公告)日：2016-09-15

申请号：US15028969

申请日：2014-10-22

Applicant: BYD COMPANY LIMITED

Inventor： QING GONG ,  XINPING LIN ,  HUI WU ,  XIAOFANG LI ,  MAOLIN REN ,  SHUMIN WANG ,  MENGXIANG WU ,  TIANYOU DENG ,  HUAITONG WEN ,  WEIFENG ZHANG ,  HONGMEI QIU

IPC: B60S1/02 ,  H05B3/40 ,  H05B3/14

CPC classification number: B60S1/026 ,  F24H3/0435 ,  H05B3/03 ,  H05B3/04 ,  H05B3/141 ,  H05B3/40 ,  H05B3/50 ,  H05B2203/009 ,  H05B2203/02 ,  H05B2203/023 ,  H05B2214/02

Abstract: A positive temperature coefficient heating assembly includes a heating core including a first metal electrode plate, a second metal electrode plate and a plurality of PTC ceramic chips; an insulating layer coated on the heating core; and a metal tube; the PTC ceramic chip includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves are formed in the first metal electrode plate, a plurality of second limit grooves are formed in the second metal electrode plate, a first end of each of the PTC ceramic chips is embedded in one of the first limit grooves, and a second end of each of the PTC ceramic chips is embedded in one of the second limit grooves.

Abstract translation: 正温度系数加热组件包括：加热芯，包括第一金属电极板，第二金属电极板和多个PTC陶瓷芯片; 涂覆在加热芯上的绝缘层; 和金属管; PTC陶瓷芯片包括正极层，负极层和陶瓷烧结层; 在第一金属电极板中形成多个第一限制槽，在第二金属电极板中形成多个第二限制槽，每个PTC陶瓷片的第一端嵌入第一极限槽中的一个， 并且每个PTC陶瓷芯片的第二端嵌入在第二极限槽中的一个中。