公开(公告)号：US20240014480A1

公开(公告)日：2024-01-11

申请号：US18373251

申请日：2023-09-26

Applicant: BYD COMPANY LIMITED

Inventor： Bing WANG ,  Wei LIU ,  Ke ZHANG ,  Haibo HU

IPC: H01M50/169 ,  H01M50/103 ,  H01M50/119 ,  H01M50/159 ,  H01M50/15

CPC classification number: H01M50/169 ,  H01M50/103 ,  H01M50/119 ,  H01M50/159 ,  H01M50/15

Abstract: A housing is configured to accommodate an electrode core. The housing includes a peripheral wall and a first cover plate. The peripheral wall includes a first opening. An edge portion is disposed on a periphery of the first cover plate, and the edge portion is configured to melt to form a melted edge around the periphery of the first cover plate. The first cover plate is configured to be bonded with the peripheral wall through the melted edge to close the first opening.