EPOXY RESIN COMPOSITION
    1.
    发明申请
    EPOXY RESIN COMPOSITION 审中-公开
    环氧树脂组合物

    公开(公告)号:US20110184092A1

    公开(公告)日:2011-07-28

    申请号:US13051796

    申请日:2011-03-18

    IPC分类号: C08L63/02 B29C39/38

    摘要: Curable epoxy resin composition, which is suitable for the production of electrical insulation systems for low, medium and high voltage applications, including at least an epoxy resin, a hardener, a mineral filler material, and optionally further additives, wherein (i) the epoxy resin component is a diglycidylether of bisphenol A (DGEBA); (ii) the hardener includes methyltetrahydrophthalic anhydride (MTHPA) and polypropylene glycol (PPG), wherein (iii) the average molecular weight of the polypropylene glycol (PPG) is within the range of about 300 to about 510 Dalton; and (iv) the molar ratio of methyltetrahydrophthalic anhydride (MTHPA) to polypropylene glycol (PPG) is within the range of about 9:1 to 19:1. A method of making the epoxy resin composition and electrical articles made therefrom are also provided.

    摘要翻译: 可固化的环氧树脂组合物,其适用于生产用于低,中,高电压应用的电绝缘系统,其至少包括环氧树脂,硬化剂,矿物填充材料和任选的其它添加剂,其中(i)环氧树脂 树脂组分是双酚A的二缩水甘油醚(DGEBA); (ii)硬化剂包括甲基四氢邻苯二甲酸酐(MTHPA)和聚丙二醇(PPG),其中(iii)聚丙二醇(PPG)的平均分子量在约300至约510道尔顿的范围内; 和(iv)甲基四氢邻苯二甲酸酐(MTHPA)与聚丙二醇(PPG)的摩尔比在约9:1至19:1的范围内。 还提供了制备环氧树脂组合物和由其制成的电气制品的方法。

    HARDENABLE EPOXY RESIN COMPOSITION
    2.
    发明申请
    HARDENABLE EPOXY RESIN COMPOSITION 审中-公开
    可再生环氧树脂组合物

    公开(公告)号:US20090186975A1

    公开(公告)日:2009-07-23

    申请号:US12355600

    申请日:2009-01-16

    IPC分类号: C08K3/12

    CPC分类号: H01B3/40 C08K5/54 C08L63/00

    摘要: A hardenable epoxy resin composition which is suitable for the production of an electrical insulation with improved thermal ageing properties, wherein said hardenable epoxy resin composition comprises an epoxy resin, a hardener, an inorganic filler composition, and a coupling agent for improving the bonding between the polymer matrix and the filler, and optionally further additives. The filler composition comprises silica and aluminum trihydride (ATH). The composition can be used for the production of an electrical insulation, and electrical articles containing such an electrical insulation system.

    摘要翻译: 一种适用于生产具有改善的热老化性能的电绝缘体的可硬化环氧树脂组合物,其中所述可硬化环氧树脂组合物包含环氧树脂,硬化剂,无机填料组合物和用于改善 聚合物基质和填料,以及任选的其它添加剂。 填料组合物包括二氧化硅和三氢化铝(ATH)。 该组合物可用于生产电绝缘体,以及含有这种电绝缘系统的电气制品。

    Diluent free epoxy resin formulation
    3.
    发明申请
    Diluent free epoxy resin formulation 审中-公开
    稀释剂自由环氧树脂配方

    公开(公告)号:US20080051549A1

    公开(公告)日:2008-02-28

    申请号:US11826942

    申请日:2007-07-19

    摘要: An epoxy resin formulation is disclosed. Such a formulation is suitable for the use as coil insulation material, wherein the formulation includes (a) a purified grade of at least one diglycidyl ether of a bisphenol compound or at least one cycloaliphatic diglycidyl ether compound or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight not exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (b) the formation optionally includes up to 50% by weight of a diglycidyl ether of a bisphenol compound or of a cycloaliphatic diglycidyl ether compound or a novolac epoxy or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (c) a polymerization catalyst.

    摘要翻译: 公开了一种环氧树脂配方。 这种制剂适合用作线圈绝缘材料,其中制剂包括(a)纯化级别的双酚化合物的至少一种二缩水甘油醚或至少一种脂环族二缩水甘油醚化合物或这些化合物的混合物,其中 化合物的环氧当量不得超过为每种化合物计算的最小环氧当量的10%; 和(b)所述形成物任选地包含至多50重量%的双酚化合物或脂环族二缩水甘油醚化合物或酚醛清漆环氧树脂的二缩水甘油醚或这些化合物的混合物,其中所述化合物的环氧当量超过10 为每种化合物计算的最小环氧当量的%; 和(c)聚合催化剂。

    EPOXY RESIN COMPOSITION
    4.
    发明申请
    EPOXY RESIN COMPOSITION 审中-公开
    环氧树脂组合物

    公开(公告)号:US20120208924A1

    公开(公告)日:2012-08-16

    申请号:US13383774

    申请日:2009-07-14

    IPC分类号: H01B3/40 C07C69/753 C08L63/00

    CPC分类号: C08G59/4276

    摘要: An exemplary curable epoxy resin composition is disclosed which includes at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride; (b) an optional glycol or polyglycol; (c) or a compound containing two carboxylic groups is included; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10% of reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition.

    摘要翻译: 公开了一种示例性的可固化环氧树脂组合物,其包括至少一种环氧树脂组分和一种硬化剂组分,以及任选的其它添加剂,其中(a)至少一部分该固化剂组分是化学改性的聚碳酸酐; (b)任选的二醇或聚二醇; (c)或含有两个羧基的化合物; 和(d)化学改性的酸酐硬化剂的存在量为至少10%的反应性硬化基团,其计算为环氧树脂组合物中存在的固化剂组分总量中包含的所有反应性硬化基团。

    CURABLE EPOXY RESIN COMPOSITION
    5.
    发明申请
    CURABLE EPOXY RESIN COMPOSITION 审中-公开
    可固化环氧树脂组合物

    公开(公告)号:US20120025151A1

    公开(公告)日:2012-02-02

    申请号:US13237470

    申请日:2011-09-20

    摘要: Curable epoxy resin composition including an epoxy resin component and a filler component and optionally a hardener component and further additives, wherein (a) the curable epoxy resin composition has been produced by separately mixing together at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives, prior to mixing theses components with the optional hardener component and with any remaining optional additives present in the curable epoxy resin composition, and that (b) the mixing together of at least a part of the epoxy resin component and at least a part of the filler component and optionally some or all of the optional additives has been carried out at a temperature higher than the casting temperature of the curable epoxy resin composition, and electrical insulation systems made therefrom.

    摘要翻译: 可固化环氧树脂组合物,其包含环氧树脂组分和填料组分以及任选的硬化剂组分和其它添加剂,其中(a)可固化环氧树脂组合物是通过将至少一部分环氧树脂组分和至少 在将这些组分与任选的硬化剂组分和存在于可固化环氧树脂组合物中的任何剩余任选的添加剂混合之前,将填料组分的一部分和任选的一些或所有任选的添加剂混合,以及(b)将 环氧树脂组分的至少一部分和填料组分的至少一部分以及任选的一些或所有任选的添加剂已经在高于可固化环氧树脂组合物的浇铸温度的温度下进行,并且制备了电绝缘体系 由此。

    CURABLE EPOXY RESIN COMPOSITION
    6.
    发明申请
    CURABLE EPOXY RESIN COMPOSITION 审中-公开
    可固化环氧树脂组合物

    公开(公告)号:US20100018750A1

    公开(公告)日:2010-01-28

    申请号:US12572872

    申请日:2009-10-02

    IPC分类号: H01B3/00 C08L63/02 C08J5/00

    摘要: A curable epoxy resin composition is provided. The composition includes at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ether of bisphenol F (DGEBF) as epoxy resins, in which the weight ratio of DGEBA:DGEBF is within the range of about 15:85 to 45:55; (ii) an anhydride hardener; (iii) and at least one plasticizer. The composition can additionally include a catalyst, at least one filler material and/or further additives. The dynamic complex viscosity value (η*) of the composition is within the range of 0.1 to 20 Pa·s. The present disclosure also provides a process for making the composition and electrical articles including an electrical insulation system made from the composition.

    摘要翻译: 提供可固化环氧树脂组合物。 该组合物包含至少一种双酚A的二缩水甘油醚(DGEBA)和至少一种作为环氧树脂的双酚F(DGEBF)的二缩水甘油醚,其中DGEBA:DGEBF的重量比在约15:85至45的范围内 :55; (ii)酸酐固化剂; (iii)和至少一种增塑剂。 该组合物还可以包括催化剂,至少一种填料和/或其它添加剂。 组合物的动态复数粘度值(eta *)在0.1〜20Pa·s的范围内。 本公开还提供了制备组合物和电气制品的方法,其包括由该组合物制成的电绝缘系统。