公开(公告)号：US20060029325A1

公开(公告)日：2006-02-09

申请号：US11245915

申请日：2005-10-07

申请人： Behzad Fardi ,  Farshid Adibi ,  Chaoyang Li ,  Anirban Bandyopadhyay ,  Mahesh Junnarkab

发明人： Behzad Fardi ,  Farshid Adibi ,  Chaoyang Li ,  Anirban Bandyopadhyay ,  Mahesh Junnarkab

IPC分类号： G02B6/12

CPC分类号： G02F1/025 ,  G02F1/0147

摘要： A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.

公开(公告)号：US06983086B2

公开(公告)日：2006-01-03

申请号：US10465210

申请日：2003-06-19

申请人： Behzad Fardi ,  Farshid Adibi ,  Chaoyang Li ,  Anirban Bandyopadhyay ,  Mahesh Junnarkar

发明人： Behzad Fardi ,  Farshid Adibi ,  Chaoyang Li ,  Anirban Bandyopadhyay ,  Mahesh Junnarkar

IPC分类号： G02B6/12

CPC分类号： G02F1/025 ,  G02F1/0147

摘要： A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.

摘要翻译： 热光器件可以形成有在热光器件下面切割衬底的沟槽。 通过去除下面的衬底，可以减少热光器件的散热。 这可能降低装置的热量预算，在一些实施例中减少了操作装置的功率要求。