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公开(公告)号:US06983086B2
公开(公告)日:2006-01-03
申请号:US10465210
申请日:2003-06-19
IPC分类号: G02B6/12
CPC分类号: G02F1/025 , G02F1/0147
摘要: A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.
摘要翻译: 热光器件可以形成有在热光器件下面切割衬底的沟槽。 通过去除下面的衬底,可以减少热光器件的散热。 这可能降低装置的热量预算,在一些实施例中减少了操作装置的功率要求。
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公开(公告)号:US20060029325A1
公开(公告)日:2006-02-09
申请号:US11245915
申请日:2005-10-07
IPC分类号: G02B6/12
CPC分类号: G02F1/025 , G02F1/0147
摘要: A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.
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