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公开(公告)号:US6064286A
公开(公告)日:2000-05-16
申请号:US126616
申请日:1998-07-31
CPC分类号: H01L23/66 , H01L2924/0002
摘要: A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).
摘要翻译: 一种封装集成电路(20,20a,20b),其包括至少一个波导端口(44,44a,44b)和至少一个互连(26,26a,26b),所述互连电连接到集成电路(30,30a, 30b)。