公开(公告)号：US07749781B2

公开(公告)日：2010-07-06

申请号：US11757355

申请日：2007-06-02

申请人： Bily Wang ,  Jonnie Chuang ,  Miko Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Miko Huang

IPC分类号： H01L21/00

CPC分类号： H01L33/64 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.

摘要翻译： 一种具有高散热效率的发光二极管的制造方法，将增厚的金属形成为多个支撑体。 支撑体上具有第一电极和第二电极。 第一电极形成有槽。 发射可见光或不可见光的芯片粘附在槽中。 然后，将两根引线焊接在芯片上。 两个引线中的每一个的一端分别焊接到第一和第二电极。 各种胶水点缀在芯片，粘合剂，引线和支架上。 最后，胶水通过热压成型工艺形成具有封装芯片，粘合剂，引线和支撑体的座和透镜。

公开(公告)号：US20080191235A1

公开(公告)日：2008-08-14

申请号：US11757356

申请日：2007-06-02

申请人： Bily WANG ,  Jonnie Chuang ,  Miko Huang

发明人： Bily WANG ,  Jonnie Chuang ,  Miko Huang

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H01L33/64 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.

摘要翻译： 具有高散热效果的发光二极管结构包括引线框架，芯片，两根引线，内部壳体和外部壳体。 引线框架具有第一电极和第二电极，并且第一电极形成用于将可见光或不可见光芯片安装在空腔中的空腔，并且芯片电耦合到两个引线，并且两个引线的一端 电连接并分别耦合到第一和第二电极，并且芯片具有内部壳体，并且引线框架的两个引线和内部壳体的表面被具有基部和透镜的外部壳体包裹。