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公开(公告)号：US12215413B2
公开(公告)日：2025-02-04
申请号：US17418200
申请日：2020-12-29
Inventor： Fengli Ji , Jinsan Park , Yidan Zhu
Abstract: Provided by the present disclosure are a mask assembly and a manufacturing method thereof. In the mask assembly, a plurality of connecting posts are arranged at intervals on an outer periphery of a body of a metal plate, and a plurality of grooves matched with the connecting posts are arranged on a metal frame.
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公开(公告)号：US20210384149A1
公开(公告)日：2021-12-09
申请号：US16332291
申请日：2018-10-15
Inventor： Hongwei Ma , Youngyik Ko , Tairong Kim , Xiangdan Dong , Jinsan Park
IPC: H01L23/00 , G02F1/1345 , H01L27/32 , H01L25/00 , H01L25/18 , H01L25/065
Abstract: The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.
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公开(公告)号：US11011551B2
公开(公告)日：2021-05-18
申请号：US15751410
申请日：2017-08-09
Inventor： Xiangdan Dong , Young Yik Ko , Jinsan Park
IPC: H01L23/12 , H01L23/48 , H01L21/00 , H01L21/4763 , H01L27/12 , H01L27/32 , H05K1/18 , H01L23/498 , H01L51/00 , H01L23/522
Abstract: An array substrate and display apparatus, the array substrate comprising a base substrate (10) and signal lines (VDD, VSS) provided on the base substrate (10), wherein at least one electrically conductive element (12) corresponding to the signal lines (VDD, VSS) is further provided on the base substrate (10), the signal lines (VDD, VSS) are connected in parallel with corresponding electrically conductive elements (12), and the electrically conductive elements (12) corresponding to different signal lines (VDD, VSS) are insulated from one another. Thus, resistance of the signal lines (VDD, VSS) can be reduced and the display effect can be improved.
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4.发明申请公开(公告)号：US20180212167A1
公开(公告)日：2018-07-26
申请号：US15544636
申请日：2016-11-15
Inventor： Pil Geun Chun , Chuan Peng , Jinsan Park , Jinhwan Hwang
IPC: H01L51/00 , H01L51/56 , H01L51/52 , G02F1/1333 , G02F1/1335 , H01L27/12 , H01L27/32 , G06F3/041 , G06F3/044
Abstract: The present application discloses a flexible display panel having a display substrate and an encapsulation substrate facing the display substrate. The encapsulation substrate includes a first base substrate. The display substrate includes a second base substrate; a display unit on the second base substrate; and an encapsulating layer on a side of the display unit distal to the second base, substrate and proximal to the encapsulation substrate. The second base substrate includes a moisture-resistant and oxygen-resistant inorganic material having an etching rate smaller than that of a glass substrate for an etchant for etching the glass substrate.
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公开(公告)号：US11228006B2
公开(公告)日：2022-01-18
申请号：US16097699
申请日：2018-02-05
Inventor： Xiangdan Dong , Youngyik Ko , Jinsan Park , Wanli Dong
Abstract: An OLED display substrate, a manufacturing method thereof, a packaging structure and a display device are provided. The OLED display substrate includes a display region, a barrier structure arranged at a periphery of the OLED display substrate, and a cathode lapping region arranged between the display region and the barrier structure. The OLED display substrate has an uneven surface at the cathode lapping region.
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Patent Agency Ranking
公开(公告)号：US20200013840A1
公开(公告)日：2020-01-09
申请号：US15772246
申请日：2017-09-14
Inventor： Young Yik Ko , Xiangdan Dong , Jinsan Park , Wenbao Gao , Guobo Yang , Haijun Qiu , Wanli Dong , Benlian Wang
Abstract: The disclosure discloses a display panel, a display device, and a method for manufacturing the display panel, where a chip on film is adhered on a frame edge of a side of a display substrate away from a display face of the display substrate through an insulation adhesive, and then signal lines on a frame edge of the display face of the display substrate are connected with connection terminals arranged on a side of the chip on film away from the display substrate through an electrically conductive material in a plurality of connection holes running through the display substrate, the insulation adhesive and the chip on film, so a pad bending process can be dispensed with, and there will be no pad bending area on the frame edge of the display panel, thus further narrowing a bezel of the display panel.
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公开(公告)号：US11367698B2
公开(公告)日：2022-06-21
申请号：US16332291
申请日：2018-10-15
Inventor： Hongwei Ma , Youngyik Ko , Tairong Kim , Xiangdan Dong , Jinsan Park
IPC: H01L23/00 , G02F1/1345 , H01L25/065 , H01L25/18 , H01L25/00 , H01L27/32
Abstract: The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.
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公开(公告)号：US11222939B2
公开(公告)日：2022-01-11
申请号：US16080346
申请日：2017-09-29
Inventor： Young Yik Ko , Xiangdan Dong , Jinsan Park , Wenbao Gao , Guobo Yang , Haijun Qiu , Wanli Dong , Benlian Wang
Abstract: A display panel includes a display substrate, a chip-on-film provided at a bezel away from a display face of the display substrate, an insulation adhesive filled between the display substrate and the chip-on-film, and an integrated circuit chip fixed at a side of the chip-on-film away from the display substrate, the chip-on-film is fixed at the bezel away from the display face of the display substrate by the insulation adhesive, at the bezel there are a plurality of connection holes penetrating through the display substrate and the insulation adhesive, and conductive material filled in the respective connection holes, and signal lines at the bezel at the display face of the display substrate are connected with connection terminals provided at a side of the chip-on-film facing the display substrate via the conductive material.
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公开(公告)号：US10997952B2
公开(公告)日：2021-05-04
申请号：US16473023
申请日：2018-11-12
Inventor： Young Yik Ko , Tingliang Liu , Xiangdan Dong , Jinsan Park
IPC: G02F1/1333 , G06F3/041 , G09G5/38 , G09G3/3275 , H01L27/32 , H01L51/52 , H01L27/12
Abstract: A display panel and a driving method thereof, and a display device are disclosed. The display panel includes: a pixel region, including a first pixel region and a second pixel region located around the first pixel region, the first pixel region and the second pixel region each including a plurality of pixels; a photosensitive layer, located at least in the second pixel region; a cover plate, on a side of the pixel region for displaying, and the cover plate including a light transmission region and a light shielding layer surrounding the light transmission region. The light shielding layer coincides with at least a portion of the second pixel region in a direction perpendicular to the cover plate, and the photosensitive layer is configured to determine a position of the light transmission region.
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10.发明授权公开(公告)号：US10199438B2
公开(公告)日：2019-02-05
申请号：US14906504
申请日：2015-09-08
Applicant: Boe Technology Group Co., Ltd.
Inventor： Joohyeon Lee , Lujiang Huangfu , Jinsan Park
Abstract: A top-emitting organic electroluminescent display panel, a manufacturing method, and a display device. The top-emitting organic electroluminescent display panel comprises: a substrate, a layer of white organic light emitting diodes and a thin film encapsulation layer arranged on the substrate in sequence. The thin film encapsulation layer comprises at least two inorganic thin film layers and at least one organic thin film layer. At least one organic thin film layer is a color filter layer, the color filter layer being arranged between the at least two inorganic thin film layers. Since one of the organic thin film layers in the thin film encapsulation layer is a color filter layer, the color filter layer does not have to be arranged above the thin film encapsulation layer separately, thus reducing the number of film layers, simplifying the film layer structure, reducing manufacturing costs, and improving the luminous efficiency and the display effect.
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