公开(公告)号：US08695990B2

公开(公告)日：2014-04-15

申请号：US13078391

申请日：2011-04-01

申请人： Bojko Vodanovic ,  Jakov Kogan ,  Marc Lévesque ,  Alexandr Filenkov

发明人： Bojko Vodanovic ,  Jakov Kogan ,  Marc Lévesque ,  Alexandr Filenkov

IPC分类号： B23B31/30

CPC分类号： H01L21/6838

摘要： An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.

摘要翻译： 用于固定大致圆形晶片的装置和方法使用具有多个张紧槽的卡盘，每个张紧槽具有至少一个具有基本上小于外部区域半径的弯曲半径的弧形弯曲部，以及与每个凹槽相互连接的真空源。 当晶片被放置在与卡盘中心同心并且施加到凹槽的真空源的表面上时，晶片被牢固地保持在表面上而没有变形。

公开(公告)号：US20110241298A1

公开(公告)日：2011-10-06

申请号：US13078391

申请日：2011-04-01

申请人： Bojko VODANOVIC ,  Jakov Kogan ,  Marc Lévesque ,  Alexandr Filenkov

发明人： Bojko VODANOVIC ,  Jakov Kogan ,  Marc Lévesque ,  Alexandr Filenkov

IPC分类号： B23B31/30

CPC分类号： H01L21/6838

摘要： An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface.Additionally, there is disclosed an apparatus for securing a wafer comprising a chuck and a collar comprising a rigid support and an o-ring, the o-ring having a diameter slightly smaller than the outer perimeter. When the wafer is lowered onto the surface in a position concentric with the check centre, the collar is placed against the upper surface concentric with the perimeter and the vacuum source is applied securing the wafer to the surface.

摘要翻译： 公开了一种用于固定基本圆形的晶片的装置和方法，该晶片包括夹头，该卡盘包括多个张紧槽，每个拉伸槽包括至少一个具有基本上小于外部区域半径的弯曲半径的弧形弯曲部，以及与每个凹槽相互连接的真空源 。 当将晶片放置在与卡盘中心同心并且施加到凹槽的真空源的表面上时，晶片被牢固地保持在表面上。 此外，公开了一种用于固定包括卡盘和包括刚性支撑件和O形环的套环的晶片的装置，O形环的直径略小于外周边。 当晶片在与支架中心同心的位置处下降到表面上时，套环抵靠与周边同心的上表面放置，并且施加真空源将晶片固定到表面。