摘要:
A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.
摘要:
A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member
摘要:
A multilayer filter includes: a ceramic body in which a plurality of dielectric layers are laminated; an external ground electrode provided on an outer surface of the ceramic body and connected to a ground; an inductor pattern electrode provided on at least one of the dielectric layers and having one end connected to the external ground electrode; a capacitor pattern electrode provided on at least one of the dielectric layers; an external terminal electrode electrically connecting the inductor pattern electrode to the capacitor pattern electrode and forming a closed loop for generating inductance through the external ground electrode; and a variable dielectric layer provided between the capacitor pattern electrode and the inductor pattern electrode and adjusting a magnitude of inductance generated by the inductor pattern electrode.
摘要:
According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
摘要:
A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member.
摘要:
According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.