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1.发明授权BGA footprint pattern for increasing number of routing channels per PCB layer 有权BGA占用空间图，每个PCB层增加路由通道数公开(公告)号：US08273994B2
公开(公告)日：2012-09-25
申请号：US12647737
申请日：2009-12-28
申请人： Boris Reynov , Ping Yue , Shreeram Siddhaye , John Cleveland , Chebrolu Srinivas , Srinivas Venkataraman
发明人： Boris Reynov , Ping Yue , Shreeram Siddhaye , John Cleveland , Chebrolu Srinivas , Srinivas Venkataraman
CPC分类号： H05K1/114 , H05K2201/09418 , H05K2201/097 , H05K2201/09709 , H05K2201/10734
摘要： A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.
摘要翻译： 印刷电路板（PCB）包括球栅阵列（BGA）。 PCB还包括具有圆形形状的第一BGA焊盘和具有圆形形状的第一通孔，其中第一通孔的圆形与第一BGA焊盘的圆形部分的一部分重叠并相对于中心对角地旋转 的第一个BGA垫。 PCB还包括具有圆形形状的第二BGA焊盘和具有圆形形状的第二通孔，其中第二通孔的圆形与第二BGA焊盘的圆形部分的一部分重叠并且相对于中心对角地旋转 并且其中第二通孔的中心位于距离第一通孔的中心的第一距离处，并且相对于穿过第一通孔的中心的轴线处于第一角度。
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2.发明申请BGA FOOTPRINT PATTERN FOR INCREASING NUMBER OF ROUTING CHANNELS PER PCB LAYER 有权BGA FOOTPRINT模式，用于增加每个PCB层的路由通道数公开(公告)号：US20110155434A1
公开(公告)日：2011-06-30
申请号：US12647737
申请日：2009-12-28
申请人： Boris REYNOV , Ping Yue , Shreeram Siddhaye , John Cleveland , Chebrolu Srinivas , Srinivas Venkataraman
发明人： Boris REYNOV , Ping Yue , Shreeram Siddhaye , John Cleveland , Chebrolu Srinivas , Srinivas Venkataraman
IPC分类号： H05K1/11
CPC分类号： H05K1/114 , H05K2201/09418 , H05K2201/097 , H05K2201/09709 , H05K2201/10734
摘要： A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.
摘要翻译： 印刷电路板（PCB）包括球栅阵列（BGA）。 PCB还包括具有圆形形状的第一BGA焊盘和具有圆形形状的第一通孔，其中第一通孔的圆形与第一BGA焊盘的圆形部分的一部分重叠并相对于中心对角地旋转 的第一个BGA垫。 PCB还包括具有圆形形状的第二BGA焊盘和具有圆形形状的第二通孔，其中第二通孔的圆形与第二BGA焊盘的圆形部分的一部分重叠并且相对于中心对角地旋转 并且其中第二通孔的中心位于距离第一通孔的中心的第一距离处，并且相对于穿过第一通孔的中心的轴线处于第一角度。
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