公开(公告)号：US20250132283A1

公开(公告)日：2025-04-24

申请号：US18921261

申请日：2024-10-21

Applicant: Brewer Science, Inc.

Inventor： Xin Li ,  Yongqing Grace Jiang ,  Ruimeng Zhang ,  Arthur O. Southard ,  Luke M. Prenger

IPC: H01L23/00

Abstract: A dual-layer temporary bonding system for semiconductor manufacturing including first and second bonding layers is provided. The first bonding layer includes a bond line adhesion promoter that acts as a bond line adhesion promoter during the bonding process. The second bonding layer includes one or more functionalities that will react with the bond line adhesion promoter during the bonding process. The materials and methods of this system can provide increased, precisely controlled, bond line adhesion while at the same time also satisfying other desired performance criteria.