公开(公告)号：US20210332188A1

公开(公告)日：2021-10-28

申请号：US17241174

申请日：2021-04-27

Applicant: Brewer Science, Inc.

Inventor： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

IPC: C08G73/00 ,  C09J179/00 ,  B32B43/00 ,  B32B7/12 ,  B32B17/06 ,  H01L21/683

Abstract: The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

公开(公告)号：US20220127496A1

公开(公告)日：2022-04-28

申请号：US17504272

申请日：2021-10-18

Applicant: Brewer Science, Inc.

Inventor： Rama Puligadda ,  Xiao Liu ,  Luke M. Prenger ,  Xavier Martinez

IPC: C09J5/06 ,  H01L21/683 ,  C08G73/02

Abstract: A method is described for debonding a carrier and device substrate using a high-intensity, pulsed, broadband light system that is suitable for wafer-level packaging applications. The carrier substrate is a transparent wafer with a light absorbing layer on one side of the wafer. This method utilizes the high intensity light to rapidly heat up the light absorbing layer to decompose or melt a bonding material layer that is adjacent to the light absorbing layer. After exposure to light, the carrier substrate can be lifted off the surface of the device wafer with little or no force.

公开(公告)号：US20250132283A1

公开(公告)日：2025-04-24

申请号：US18921261

申请日：2024-10-21

Applicant: Brewer Science, Inc.

Inventor： Xin Li ,  Yongqing Grace Jiang ,  Ruimeng Zhang ,  Arthur O. Southard ,  Luke M. Prenger

IPC: H01L23/00

Abstract: A dual-layer temporary bonding system for semiconductor manufacturing including first and second bonding layers is provided. The first bonding layer includes a bond line adhesion promoter that acts as a bond line adhesion promoter during the bonding process. The second bonding layer includes one or more functionalities that will react with the bond line adhesion promoter during the bonding process. The materials and methods of this system can provide increased, precisely controlled, bond line adhesion while at the same time also satisfying other desired performance criteria.

公开(公告)号：US12024594B2

公开(公告)日：2024-07-02

申请号：US17241174

申请日：2021-04-27

Applicant: Brewer Science, Inc.

Inventor： Luke M. Prenger ,  Qi Wu ,  Xiao Liu

IPC: C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/00 ,  C09J179/00 ,  H01L21/683

CPC classification number: C08G73/00 ,  B32B7/12 ,  B32B17/06 ,  B32B43/006 ,  C09J179/00 ,  H01L21/6835 ,  B32B2307/412 ,  B32B2457/00 ,  H01L2221/68381

Abstract: The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.