公开(公告)号：US09349643B2

公开(公告)日：2016-05-24

申请号：US14229310

申请日：2014-03-28

Applicant: Brewer Science Inc.

Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

IPC: H01L21/687 ,  H01L21/673 ,  H01L21/683 ,  B32B37/14 ,  B32B38/18 ,  H01L21/768 ,  B32B37/26

CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。

公开(公告)号：US20140295656A1

公开(公告)日：2014-10-02

申请号：US14229310

申请日：2014-03-28

Applicant: Brewer Science Inc.

Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

IPC: H01L21/677 ,  H01L21/768 ,  H01L21/28 ,  H01L21/306

CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。