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    APPARATUS AND METHOD FOR THIN WAFER TRANSFER
    2.
    发明申请
    APPARATUS AND METHOD FOR THIN WAFER TRANSFER 有权
    用于薄膜转移的装置和方法

    公开(公告)号：US20140295656A1

    公开(公告)日：2014-10-02

    申请号：US14229310

    申请日：2014-03-28

    Applicant: Brewer Science Inc.

    Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

    IPC: H01L21/677 ,  H01L21/768 ,  H01L21/28 ,  H01L21/306

    CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

    Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

    Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。

    Apparatus and method for thin wafer transfer
    5.
    发明授权
    Apparatus and method for thin wafer transfer 有权
    薄晶片传输的装置和方法

    公开(公告)号：US09349643B2

    公开(公告)日：2016-05-24

    申请号：US14229310

    申请日：2014-03-28

    Applicant: Brewer Science Inc.

    Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/683 ,  B32B37/14 ,  B32B38/18 ,  H01L21/768 ,  B32B37/26

    CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

    Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

    Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。

    MULTI-SIZE ADAPTABLE SPIN CHUCK SYSTEM
    6.
    发明申请
    MULTI-SIZE ADAPTABLE SPIN CHUCK SYSTEM 审中-公开
    多尺寸适配旋钮系统

    公开(公告)号：US20150336127A1

    公开(公告)日：2015-11-26

    申请号：US14716143

    申请日：2015-05-19

    Applicant: Brewer Science Inc.

    Inventor： Kirk Emory ,  Brandon Wilson ,  Roger Ruesing

    IPC: B05C5/02

    CPC classification number: H01L21/68785 ,  B05C11/08 ,  B05C13/02 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715 ,  H01L21/68792 ,  Y10T29/50 ,  Y10T279/11

    Abstract: A novel interchangeable spin chuck system is provided that allows the user to quickly change substrate sizes and spin chuck styles without any extra tools. This system has a two-piece design and overcomes many of the drawbacks of previous spin chuck designs, such as difficulty in seating the spin chuck and ensuring that the spin chuck is at a consistent flatness and height. Furthermore, this spin chuck system allows the spin chucks to be manufactured at a lower cost. Thus, rather than restricting users to “make do” with incorrect spin chucks due to budget limitations, this economical design gives users access to a wider range of spin chuck sizes and styles.

    Abstract translation: 提供了一种新颖的可互换旋转卡盘系统，其允许用户快速地改变基板尺寸和旋转卡盘样式，而无需任何额外的工具。 该系统具有两件式设计，并克服了以前的旋转卡盘设计的许多缺点，例如难以安置旋转卡盘并确保旋转卡盘处于一致的平坦度和高度。 此外，该旋转卡盘系统允许以更低的成本制造旋转卡盘。 因此，由于预算的限制，这种经济的设计使用户不必限制使用错误的旋转卡盘“做”，用户可以访问更广泛的旋转卡盘尺寸和样式。

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