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公开(公告)号:US07668430B2
公开(公告)日:2010-02-23
申请号:US11000363
申请日:2004-11-29
申请人: Brian J. McClellan , Dale C. Madsen , Robin L. Berg, Jr. , Joseph S. Czyscon , Steven W. Skradde , Derek G. Sayres , Todd Husom
发明人: Brian J. McClellan , Dale C. Madsen , Robin L. Berg, Jr. , Joseph S. Czyscon , Steven W. Skradde , Derek G. Sayres , Todd Husom
IPC分类号: G02B6/00
CPC分类号: G02B6/4452 , G02B6/3897 , H05K7/1448
摘要: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections. Module embodiments may also include circuitry for converting electrical signals to optical and optical signals to electrical, and the circuitry may selectively operate at multiple data rates.
摘要翻译: 公开了与电信机箱一起使用的电信机箱和相关模块。 电信机箱的实施例包括诸如水平通道和/或具有在一个表面中的脊和/或狭槽的水平表面的结构,而另一个的脊是用于接收安装在底盘内的模块的边缘的结构。 实施例的其他结构包括在水平表面中的分隔槽,其接纳分隔壁的边缘以将分隔壁固定就位,包括在底盘内的热障板表面和/或具有半径限制器的电缆引导件。 模块实施例包括诸如具有成角度部分的面板的结构,其中光纤电缆连接指向光纤电缆的行进方向。 其他模块结构包括围绕电路板的壳体和/或提供具有光纤电缆连接的倾斜部分的壳体。 模块实施例还可以包括用于将电信号转换为光信号和光信号到电的电路,并且电路可以以多个数据速率选择性地操作。
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公开(公告)号:US06824312B2
公开(公告)日:2004-11-30
申请号:US09873763
申请日:2001-06-04
申请人: Brian J. McClellan , Dale C. Madsen , Robin L. Berg, Jr. , Joseph S. Czyscon , Steven W. Skradde , Derek G. Sayres , Todd Husom
发明人: Brian J. McClellan , Dale C. Madsen , Robin L. Berg, Jr. , Joseph S. Czyscon , Steven W. Skradde , Derek G. Sayres , Todd Husom
IPC分类号: G02B636
CPC分类号: G02B6/4452 , G02B6/3897 , H05K7/1448
摘要: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections. Module embodiments may also include circuitry for converting electrical signals to optical and optical signals to electrical, and the circuitry may selectively operate at multiple data rates.
摘要翻译: 公开了与电信机箱一起使用的电信机箱和相关模块。 电信机箱的实施例包括诸如水平通道和/或具有在一个表面中的脊和/或狭槽的水平表面的结构,而另一个的脊是用于接收安装在底盘内的模块的边缘的结构。 实施例的其他结构包括在水平表面中的分隔槽,其接纳分隔壁的边缘以将分隔壁固定就位,包括在底盘内的热障板表面和/或具有半径限制器的电缆引导件。 模块实施例包括诸如具有成角度部分的面板的结构,其中光纤电缆连接指向光纤电缆的行进方向。 其他模块结构包括围绕电路板的壳体和/或提供具有光纤电缆连接的倾斜部分的壳体。 模块实施例还可以包括用于将电信号转换为光信号和光信号到电的电路,并且电路可以以多个数据速率选择性地操作。
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3.
公开(公告)号:US07778597B2
公开(公告)日:2010-08-17
申请号:US11739523
申请日:2007-04-24
申请人: Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
发明人: Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
IPC分类号: H04B7/15
CPC分类号: H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
摘要翻译: 公开了一种用于具有包括STM-1(155.52兆比特每秒)的数据速率的信号的电信底盘,模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构,包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构,用于建立屏蔽和散热,包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱,模块和中继器电路可以结合使用。
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4.
公开(公告)号:US07224947B2
公开(公告)日:2007-05-29
申请号:US11126853
申请日:2005-05-10
申请人: Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven N. Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
发明人: Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven N. Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
IPC分类号: H04B1/38
CPC分类号: H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
摘要翻译: 公开了一种用于具有包括STM-1(155.52兆比特每秒)的数据速率的信号的电信底盘,模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构,包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构,用于建立屏蔽和散热,包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱,模块和中继器电路可以结合使用。
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