摘要:
A smart entry system for a vehicle having a lockable trunk is provided. The smart entry system includes portable devices, an onboard transmitter for transmitting request signals to the portable devices, an onboard receiver for receiving identification signals from the portable devices, and a trunk lockout protection feature. The trunk lockout protection feature is configured to receive a command signal to either initiate a trunk lockout protection sequence to unlock the trunk in the event that one of the portable devices is locked in the trunk or to disable the trunk lockout protection sequence to permit the trunk to remain in a locked state in the event that one of the portable devices is locked in the trunk.
摘要:
A smart entry system for a vehicle having a lockable trunk is provided. The smart entry system includes portable devices, an onboard transmitter for transmitting request signals to the portable devices, an onboard receiver for receiving identification signals from the portable devices, and a trunk lockout protection feature. The trunk lockout protection feature is configured to receive a command signal to either initiate a trunk lockout protection sequence to unlock the trunk in the event that one of the portable devices is locked in the trunk or to disable the trunk lockout protection sequence to permit the trunk to remain in a locked state in the event that one of the portable devices is locked in the trunk.
摘要:
A liquid thermosetting filling composition comprising (A) an epoxy resin assuming a liquid state at room temperature, (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) an inorganic filler is useful as an ink for permanently filling such holes as via holes and through holes in printed circuit boards of a multilayer board or a double-sided board, a sealing compound for IC packages, and the like. This composition is a two-stage thermally curing type. In a method for permanently filling holes in a printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. The parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.