公开(公告)号：US07884468B2

公开(公告)日：2011-02-08

申请号：US12178489

申请日：2008-07-23

申请人： Brooks S Mann ,  George R. Woody ,  Terence G. Ward ,  David F. Nelson

发明人： Brooks S Mann ,  George R. Woody ,  Terence G. Ward ,  David F. Nelson

IPC分类号： H01L23/34

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

摘要翻译： 提供一种用于液体冷却功率半导体器件的冷却装置。 该装置包括用于将液体冷却剂引导到功率半导体器件的冷却剂分流器。 冷却剂分流器具有用于将冷却剂分流器分成第一腔和第二腔的第一板。 位于功率半导体器件附近的第二腔。 第一板还包括用于将第一空腔与第二空腔流体耦合的开口，使得液体冷却剂通过第一板中的开口流入第一空腔，并进入第二腔以冷却功率半导体器件。 第一腔体具有在下游方向上大致减小的横截面积，并且第二腔体具有在下游方向上大致增加的横截面面积。