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    Cooling systems for power semiconductor devices
    1.
    发明授权
    Cooling systems for power semiconductor devices 有权
    功率半导体器件的冷却系统

    公开(公告)号：US07884468B2

    公开(公告)日：2011-02-08

    申请号：US12178489

    申请日：2008-07-23

    申请人： Brooks S Mann ,  George R. Woody ,  Terence G. Ward ,  David F. Nelson

    发明人： Brooks S Mann ,  George R. Woody ,  Terence G. Ward ,  David F. Nelson

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

    摘要翻译： 提供一种用于液体冷却功率半导体器件的冷却装置。 该装置包括用于将液体冷却剂引导到功率半导体器件的冷却剂分流器。 冷却剂分流器具有用于将冷却剂分流器分成第一腔和第二腔的第一板。 位于功率半导体器件附近的第二腔。 第一板还包括用于将第一空腔与第二空腔流体耦合的开口，使得液体冷却剂通过第一板中的开口流入第一空腔，并进入第二腔以冷却功率半导体器件。 第一腔体具有在下游方向上大致减小的横截面积，并且第二腔体具有在下游方向上大致增加的横截面面积。

    SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE
    6.
    发明申请
    SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE 有权
    用于电动或混合动力汽车的半导体冷却系统

    公开(公告)号：US20080225482A1

    公开(公告)日：2008-09-18

    申请号：US11685726

    申请日：2007-03-13

    申请人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P. Yankoski ,  David F. Nelson

    发明人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P. Yankoski ,  David F. Nelson

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

    摘要翻译： 提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。

    Semiconductor cooling system for use in electric or hybrid vehicle
    8.
    发明授权
    Semiconductor cooling system for use in electric or hybrid vehicle 有权
    用于电动或混合动力汽车的半导体冷却系统

    公开(公告)号：US07580261B2

    公开(公告)日：2009-08-25

    申请号：US11685726

    申请日：2007-03-13

    申请人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P Yankoski ,  David F. Nelson

    发明人： Gregory Scott Smith ,  George John ,  Terence G. Ward ,  Edward P Yankoski ,  David F. Nelson

    IPC分类号： H05K7/20 ,  F28F7/00 ,  F25D17/02

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

    摘要翻译： 提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。

    Cooling systems and methods for integration electric motor-inverters
    9.
    发明授权
    Cooling systems and methods for integration electric motor-inverters 有权
    集成电动机逆变器的冷却系统和方法

    公开(公告)号：US07723874B2

    公开(公告)日：2010-05-25

    申请号：US12032359

    申请日：2008-02-15

    申请人： George R. Woody ,  Karl D. Conroy ,  James M. Nagashima ,  David F. Nelson ,  Eric R. Ostrom ,  Gregory S. Smith

    发明人： George R. Woody ,  Karl D. Conroy ,  James M. Nagashima ,  David F. Nelson ,  Eric R. Ostrom ,  Gregory S. Smith

    IPC分类号： H02K9/00

    CPC分类号： H02K9/20

    摘要： Cooling systems and methods are provided for an integrated electric motor-inverter, where the integrated electric motor-inverter includes a housing, a motor, and an inverter, the motor and the inverter are disposed within the housing, and the motor includes a stator. The system includes a cooling jacket, a first coolant, a condenser, a spray head, and a second coolant. The cooling jacket is disposed concentric to the stator and includes an inner wall and an outer wall. The inner wall is in direct contact with the stator. The first coolant is disposed between the cooling jacket inner and outer walls. The condenser is disposed concentric to the cooling jacket. The spray head is disposed adjacent the inverter. The second coolant is in flow communication with the spray head.

    摘要翻译： 为集成电动机 - 逆变器提供冷却系统和方法，其中集成电动机 - 逆变器包括壳体，电动机和逆变器，电动机和逆变器设置在壳体内，并且电动机包括定子。 该系统包括冷却套，第一冷却剂，冷凝器，喷头和第二冷却剂。 冷却套与所述定子同心地设置，并且包括内壁和外壁。 内壁与定子直接接触。 第一冷却剂设置在冷却套内壁和外壁之间。 冷凝器与冷却套筒同心设置。 喷头靠近逆变器设置。 第二冷却剂与喷头流体连通。