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公开(公告)号：US20050018386A1
公开(公告)日：2005-01-27
申请号：US10926124
申请日：2004-08-25
申请人： Bruce Beihoff , Lawrence Radosevich , Mark Phillips , Dennis Kehl , Steven Kaishian , Daniel Kannenberg
发明人： Bruce Beihoff , Lawrence Radosevich , Mark Phillips , Dennis Kehl , Steven Kaishian , Daniel Kannenberg
CPC分类号： H02M1/44 , B60L11/12 , B60L11/18 , B60L15/007 , B60L2210/20 , H02M7/003 , H05K7/20927 , Y02T10/645 , Y02T10/7005 , Y02T10/7077 , Y02T10/725
摘要： A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
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公开(公告)号：US20050068820A1
公开(公告)日：2005-03-31
申请号：US10675189
申请日：2003-09-30
申请人： Lawrence Radosevich , Steven Kaishian , Daniel Kannenberg , Timothy Roebke , Andreas Meyer , Dennis Kehl , Lee Gettelfinger
发明人： Lawrence Radosevich , Steven Kaishian , Daniel Kannenberg , Timothy Roebke , Andreas Meyer , Dennis Kehl , Lee Gettelfinger
CPC分类号： H02M7/003 , H01L25/072 , H01L2224/48091 , H01L2224/49109 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.
摘要翻译： 公开了一种用于与诸如电力电子设备之类的开关装置一起使用的总线系统。 该系统包括大致平行的总线元件，其限定电参考平面，例如用于直流母线。 总线元件通过绝缘层彼此分开，附加的绝缘层可用于将系统与其它电路部件分离。 总线元件的一部分被扩展或暴露以允许连接到电路元件，包括封装的开关电路和能量存储或滤波电路。 总线系统可以符合各种几何配置，并且在所得到的电路中大大减少寄生电感和总环路电感。
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公开(公告)号：US20050002162A1
公开(公告)日：2005-01-06
申请号：US10663523
申请日：2003-09-16
CPC分类号： H02M1/44 , B60L11/12 , B60L11/18 , B60L15/007 , B60L2210/20 , H02M7/003 , H05K7/1432 , H05K7/20927 , Y02T10/645 , Y02T10/7005 , Y02T10/7077 , Y02T10/725 , Y10T307/50 , Y10T428/21
摘要： A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
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4.发明申请Electrical power converter method and system employing multiple output converters 有权电力转换器方法和采用多输出转换器的系统公开(公告)号：US20060092611A1
公开(公告)日：2006-05-04
申请号：US11294986
申请日：2005-12-06
IPC分类号： H05K7/20
CPC分类号： H02M1/44 , B60L11/12 , B60L11/18 , B60L15/007 , B60L2210/20 , H02M7/003 , H05K7/1432 , H05K7/20927 , Y02T10/645 , Y02T10/7005 , Y02T10/7077 , Y02T10/725 , Y10T307/50 , Y10T428/21
摘要： A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
摘要翻译： 支撑件可以接收一个或多个电力电子电路。 支撑件可能有助于通过液体通过支撑件循环从电路中除去热量。 支持与其他封装特征相结合可形成外部EMI / RFI的屏蔽和来自功率电子电路的操作产生的干扰。 可以提供特征以允许和增强电路与外部电路的连接，例如改进的终端配置。 可以组装模块化单元，其可以经由插入装置或通过与背板或类似的安装和互连结构的接口耦合到电子电路。
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