公开(公告)号：US07672140B2

公开(公告)日：2010-03-02

申请号：US12009895

申请日：2008-01-22

Applicant: Bruce Lane

Inventor： Bruce Lane

IPC: H05K7/00

CPC classification number: H05K1/184 ,  H05K3/34 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10643

Abstract: A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace. The circuit board configuration may further comprise an encapsulant at least one end of the electronic component and a conductive material between the oblique sidewall and the electronic component to seal the electronic component inside the slot.

Abstract translation: 一种电路板配置和方法，其以以电，电和机械方式支撑所述电子部件的方式包装嵌入到所述电路板中的电子部件，所述电子部件包括在所述第一表面上具有第一表面和电路迹线的电路板; 在由所述电路板的第一表面倾斜的至少一个侧壁限定的所述第一表面上形成的凹部或槽; 在所述至少一个倾斜侧壁上的两个或更多个电镀表面并电连接到所述电路迹线; 以及电子部件，其具有安装到所述两个或更多个电镀表面的两个或更多个电接触表面，使得所述电子部件物理地安装到所述倾斜侧壁并与所述电路迹线电连通。 电路板配置还可以包括密封剂电子部件的至少一个端部和在倾斜侧壁和电子部件之间的导电材料，以密封槽内的电子部件。