公开(公告)号：US11765815B2

公开(公告)日：2023-09-19

申请号：US17132242

申请日：2020-12-23

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Rashmi Prasad ,  Chandra S. Namuduri ,  Muhammad H. Alvi

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H02P27/06

CPC classification number: H05K1/0257 ,  H02P27/06 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

公开(公告)号：US11709970B1

公开(公告)日：2023-07-25

申请号：US18068316

申请日：2022-12-19

Applicant: Fend Incorporated

Inventor： Sang Cheon Lee ,  Colin Patrick Dunn

IPC: G06F21/71 ,  H05K1/18 ,  H05K1/02

CPC classification number: G06F21/71 ,  H05K1/0213 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10174

Abstract: A data diode chip provides a flexible device for collecting data from a data source and transmitting the data to a data destination using one-way data transmission. On-chip processing elements allow the data diode to identify automatically the type of connectivity provided to the data diode and configure the data diode to handle the identified type of connectivity.

公开(公告)号：US20190199232A1

公开(公告)日：2019-06-27

申请号：US16289758

申请日：2019-03-01

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Jianhong ZENG ,  Xiaoni XIN

IPC: H02M7/00 ,  H02M3/335 ,  H05K1/11 ,  H05K7/06 ,  H05K7/02 ,  H05K1/18 ,  H05K1/14 ,  H01F27/40 ,  H05K1/02 ,  H01F27/24 ,  H05K1/16 ,  H01F27/28 ,  H02M7/04

CPC classification number: H02M7/003 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/306 ,  H01F27/40 ,  H01F2027/408 ,  H02M3/33576 ,  H02M7/04 ,  H02M2001/0048 ,  H05K1/0203 ,  H05K1/0254 ,  H05K1/111 ,  H05K1/115 ,  H05K1/142 ,  H05K1/145 ,  H05K1/165 ,  H05K1/181 ,  H05K1/182 ,  H05K7/026 ,  H05K7/06 ,  H05K2201/086 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  Y02B70/1491

Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.

公开(公告)号：US20180359864A1

公开(公告)日：2018-12-13

申请号：US16003474

申请日：2018-06-08

Applicant: PITYU CONTROLS INC.

Inventor： Stevan DOBI

IPC: H05K3/34 ,  H05K1/18 ,  B23K1/00

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10022 ,  H05K2201/10174 ,  H05K2201/10583 ,  H05K2203/048

Abstract: A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.

公开(公告)号：US20180337649A1

公开(公告)日：2018-11-22

申请号：US15601692

申请日：2017-05-22

Applicant: Transtector Systems, Inc.

Inventor： Edward J. Dickman ,  Kelly A. Dane ,  Randall T. Palmer

IPC: H03H1/00 ,  H05K5/00 ,  H05K1/14 ,  H05K5/03 ,  H05K9/00 ,  H05K1/02

CPC classification number: H05K1/147 ,  H05K1/0245 ,  H05K9/0015 ,  H05K9/006 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174

Abstract: A filtering unit includes a housing having outer walls that define a volume and an inner wall that separates the volume into a first chamber and a second chamber. The filtering unit also includes a rigid/flexible circuit board. The circuit board includes a first rigid portion designed to be positioned in the first chamber. The circuit board further includes a second rigid portion designed to be positioned in the second chamber. The circuit board further includes a flexible portion connecting the first rigid portion to the second rigid portion and designed to extend around the inner wall from the first chamber to the second chamber. The filtering unit further includes a bumper designed to be positioned between one of the outer walls and the inner wall to provide waveguide functionality by reducing an amount of electric field that can pass from the first chamber to the second chamber.

公开(公告)号：US20180233434A1

公开(公告)日：2018-08-16

申请号：US15950484

申请日：2018-04-11

Applicant: Mitsubishi Electric Corporation

Inventor： Koichi MASUDA

IPC: H01L23/488 ,  H01L23/00 ,  H01L25/18 ,  H05K1/18 ,  H01L25/07

CPC classification number: H01L23/488 ,  H01L24/48 ,  H01L24/49 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2201/1053 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A first diode having a front surface anode region is mounted on a P pattern, and a second diode having a front surface cathode region is mounted on an N pattern. At this time, the first diode and the second diode are formed such that a cathode region of a front surface anode region in a first vertical relationship and an anode region of a front surface cathode region in a second vertical relationship are always located as upper portions. The front surface anode region is electrically connected to the front surface cathode region with wires provided thereover.

公开(公告)号：US20180047714A1

公开(公告)日：2018-02-15

申请号：US15559834

申请日：2016-03-23

Applicant: GD MIDEA AIRCONDITIONING EQUIPMENT CO., LTD. ,  MIDEA GROUP CO., LTD.

Inventor： Yuxiang Feng

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H05K1/11 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/06 ,  H05K1/18 ,  H05K1/02 ,  H01L23/053 ,  H05K3/34 ,  H05K3/28 ,  H01L25/00 ,  H01L23/373

CPC classification number: H01L25/18 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/565 ,  H01L22/14 ,  H01L23/053 ,  H01L23/06 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/85815 ,  H01L2224/92247 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H02M7/003 ,  H02M7/5387 ,  H05K1/0204 ,  H05K1/111 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3494 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2201/10318 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/162 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076

Abstract: An intelligent power module and a manufacturing method thereof are provided. The intelligent power module includes a radiator, an insulating layer, a circuit wiring, a circuit component and a metal wire. At least part of a lower surface of the radiator is defined as a heat dissipating area, the heat dissipating area is provided with a heat dissipating corrugation, the insulating layer is provided to an upper surface of the radiator, the circuit wiring is provided to the insulating layer, and the circuit component is provided to the circuit wiring and is connected to the circuit wiring via the metal wire.

公开(公告)号：US20170317604A1

公开(公告)日：2017-11-02

申请号：US15247135

申请日：2016-08-25

Applicant: General Electric Company

Inventor： Ravisekhar Nadimpalli Raju ,  Mark Edward Dame ,  Nathaniel Benedict Hawes

IPC: H02M7/00 ,  H01F27/28 ,  H01F38/14 ,  H05K1/02 ,  H05K3/30 ,  H01F27/10 ,  H05K1/03 ,  H05K1/18 ,  H05K7/20

CPC classification number: H02M7/003 ,  H01F27/10 ,  H01F27/2847 ,  H01F38/14 ,  H01F2027/2861 ,  H01L23/3735 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/18 ,  H05K3/30 ,  H05K7/1432 ,  H05K7/2089 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10174

Abstract: A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

公开(公告)号：US20170303385A1

公开(公告)日：2017-10-19

申请号：US15508127

申请日：2014-10-29

Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.

Inventor： Kosuke Ikeda ,  Yuji Morinaga ,  Osamu Matsuzaki

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/021 ,  H01L23/3672 ,  H01L25/07 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189 ,  H01L2924/00

Abstract: The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.

公开(公告)号：US20170280564A1

公开(公告)日：2017-09-28

申请号：US15464516

申请日：2017-03-21

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/30 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01G2/06 ,  H05K1/0353 ,  H05K1/111 ,  H05K1/113 ,  H05K1/186 ,  H05K3/0044 ,  H05K3/205 ,  H05K3/301 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.