Thermal barrier coating method and article
    1.
    发明授权
    Thermal barrier coating method and article 有权
    隔热涂层法和制品

    公开(公告)号:US07501187B2

    公开(公告)日:2009-03-10

    申请号:US10253147

    申请日:2002-09-24

    IPC分类号: B32B15/04 B32B18/00

    摘要: An outwardly grown diffusion aluminide bondcoat is formed on a superalloy substrate and has higher concentrations of Al and Pt and lower concentrations of harmful impurities (e.g. Mo, W, Cr, Ta, S, etc.) at an outermost region of the bondcoat than at an innermost region thereof adjacent the substrate. The bondcoat is pretreated prior to deposition of a ceramic thermal insulative layer in a manner that reduces grain boundary ridges on the outermost bondcoat surface without adversely affecting the outermost region thereof, and then is heat treated to thermally grow a stable alpha alumina layer on the bondcoat prior to deposition of a ceramic layer.

    摘要翻译: 外延生长的扩散铝化物键合涂层形成在超级合金基底上,并且在粘合剂涂层的最外区域具有较高浓度的Al和Pt以及较低浓度的有害杂质(例如Mo,W,Cr,Ta,S等),而不是 其最内侧区域与基板相邻。 粘结涂层在沉积陶瓷绝热层之前进行预处理,以减少最外层粘结涂层表面上的晶界脊,而不会对其最外区域产生不利影响,然后进行热处理以在粘合涂层上热稳定地生长α氧化铝层 在沉积陶瓷层之前。

    Thermal barrier coating method
    2.
    发明授权
    Thermal barrier coating method 有权
    隔热涂层法

    公开(公告)号:US06472018B1

    公开(公告)日:2002-10-29

    申请号:US09511857

    申请日:2000-02-23

    IPC分类号: C23C1606

    摘要: An outwardly grown diffusion aluminide bondcoat is formed on a superalloy substrate and has higher concentrations of Al and Pt and lower concentrations of harmful impurities (e.g. Mo, W, Cr, Ta, S, etc.) at an outermost region of the bondcoat than at an innermost region thereof adjacent the substrate. The bondcoat is pretreated prior to deposition of a ceramic thermal insulative layer in a manner that reduces grain boundary ridges on the outermost bondcoat surface without adversely affecting the outermost region thereof, and then is heat treated to thermally grow a stable alpha alumina layer on the bondcoat prior to deposition of a ceramic layer.

    摘要翻译: 外延生长的扩散铝化物键合涂层形成在超级合金基底上,并且在粘合剂涂层的最外区域具有较高浓度的Al和Pt以及较低浓度的有害杂质(例如Mo,W,Cr,Ta,S等),而不是 其最内侧区域与基板相邻。 粘结涂层在沉积陶瓷绝热层之前进行预处理,以减少最外层粘结涂层表面上的晶界脊,而不会对其最外区域产生不利影响,然后进行热处理以在粘合涂层上热稳定地生长α氧化铝层 在沉积陶瓷层之前。