公开(公告)号：US06638836B1

公开(公告)日：2003-10-28

申请号：US09727608

申请日：2000-11-30

申请人： Bruno Murari ,  Benedetto Vigna ,  Simone Sassolini ,  Francesco Ratti ,  Alberto Alessandri

发明人： Bruno Murari ,  Benedetto Vigna ,  Simone Sassolini ,  Francesco Ratti ,  Alberto Alessandri

IPC分类号： H01L2130

CPC分类号： G11B5/5552

摘要： The manufacture process includes: forming a first wafer of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit; forming microactuators, each including a rotor and a stator, in a surface portion of a second wafer of semiconductor material; attaching the second wafer to the first wafer, with the surface portion of the second wafer facing the first wafer; thinning the second wafer; attaching the second wafer to a third wafer to obtain a composite wafer; thinning the first wafer; cutting the composite wafer into a plurality of dice connected to a protection chip; removing the protection chip; attaching read/write transducers to the dice; and attaching the dice to supporting blocks for hard-disk drivers.

摘要翻译： 制造方法包括：形成容纳形成微致动器控制电路和信号前置放大电路的集成电子部件的半导体材料的第一晶片; 在半导体材料的第二晶片的表面部分形成每个包括转子和定子的微致动器; 将第二晶片附接到第一晶片，其中第二晶片的表面部分面向第一晶片; 减薄第二片晶圆; 将第二晶片连接到第三晶片以获得复合晶片; 使第一片晶片变薄; 将复合晶片切割成连接到保护芯片的多个芯片; 去除保护芯片; 将读/写换能器附接到骰子; 并将骰子连接到用于硬盘驱动器的支撑块。