公开(公告)号：US20220389587A1

公开(公告)日：2022-12-08

申请号：US17750660

申请日：2022-05-23

申请人： C. Uyemura & Co., Ltd.

发明人： Shoji IGUCHI ,  Akio ITAMURA ,  Shoichi FUKUI ,  Yukinori ODA ,  Masaaki SATO ,  Yoshihito II ,  Hiroki OKUBO

IPC分类号： C23C18/32

摘要： An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

公开(公告)号：US20240360586A1

公开(公告)日：2024-10-31

申请号：US18644980

申请日：2024-04-24

申请人： C. Uyemura & Co., Ltd.

发明人： Takuya OKAMACHI ,  Shinji TACHIBANA ,  Katsuhisa TANABE ,  Masaaki SATO ,  Yukinori ODA

IPC分类号： C25D21/18 ,  C25D3/38 ,  C25D17/02

CPC分类号： C25D21/18 ,  C25D3/38 ,  C25D17/02

摘要： A method for regenerating an electrolytic copper plating solution containing a copper ion and at least one additive selected from the group consisting of a brightener, a carrier, and a leveler at least includes: ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution; and activated carbon treatment of bringing activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity in the electrolytic copper plating solution.