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公开(公告)号：US20200276608A1
公开(公告)日：2020-09-03
申请号：US16648086
申请日：2018-08-23
摘要： A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.
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公开(公告)号：US20200149180A1
公开(公告)日：2020-05-14
申请号：US16633285
申请日：2018-05-23
摘要： A workpiece holding jig includes a back panel and a frame body, the frame body includes a main body having an annular shape, a conductive member provided all over the main body, a contact member provided along the conductive member, the contact member being electrically connected to the conductive member to come into electrical contact with a peripheral portion of the workpiece, and a seal member provided all over the main body and located on an inner side of the main body relative to the contact member, the frame body is adapted to form a sealed space that accommodates the peripheral portion of the workpiece, the conductive member, and the contact member in a state where the seal member and the contact member are in contact with the peripheral portion, and the frame body includes a liquid inlet through which a liquid is injected into the sealed space.
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公开(公告)号：US20240360586A1
公开(公告)日：2024-10-31
申请号：US18644980
申请日：2024-04-24
摘要： A method for regenerating an electrolytic copper plating solution containing a copper ion and at least one additive selected from the group consisting of a brightener, a carrier, and a leveler at least includes: ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution; and activated carbon treatment of bringing activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity in the electrolytic copper plating solution.
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