公开(公告)号：US20230319996A1

公开(公告)日：2023-10-05

申请号：US18187311

申请日：2023-03-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOJI NOGUCHI ,  SATORU HIGUCHI ,  MITSUTOSHI HASEGAWA

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/147 ,  H05K1/181

Abstract: An electronic module includes a rigid printed circuit member having a first electrode, a flexible printed wiring member having a second electrode, and a solder member having first, second, and third portions. A first direction is perpendicular to, and a second direction is parallel to, a joined surface between the first electrode and the solder member. In the first direction, a second region of the first electrode partially overlaps a leading edge of the second electrode. In the second direction, the second portion is located between the first portion and the third portion and is continuous to each of the first portion and the third portion. A height of the third portion from a reference surface including the joined surface is larger than a height of the second portion from the reference surface and is smaller than a height of the first portion from the reference surface.

公开(公告)号：US20250047966A1

公开(公告)日：2025-02-06

申请号：US18927517

申请日：2024-10-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： YUYA OKADA ,  KOJI NOGUCHI ,  MITSUTOSHI HASEGAWA

IPC: H04N23/57 ,  G06F1/16 ,  H05K1/03

Abstract: An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.

公开(公告)号：US20240260167A1

公开(公告)日：2024-08-01

申请号：US18415119

申请日：2024-01-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOJI NOGUCHI ,  MITSUTOSHI HASEGAWA ,  SATORU HIGUCHI

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H01L23/49838 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10068

Abstract: A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.