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    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME
    1.
    发明申请
    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME 审中-公开
    电子设备及其制造方法

    公开(公告)号：US20110222222A1

    公开(公告)日：2011-09-15

    申请号：US13108573

    申请日：2011-05-16

    申请人： CHARLES DOUGLAS MACPHERSON ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    发明人： CHARLES DOUGLAS MACPHERSON ,  Dennis Damon Walker ,  Matthew Stainer ,  Christopher Todd Knudson ,  Gang Yu

    IPC分类号： H05K7/00 ,  B05D5/00 ,  H05K13/00 ,  B05D1/36

    CPC分类号： H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

    摘要： An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

    摘要翻译： 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME
    3.
    发明申请
    ELECTRONIC DEVICES AND PROCESSES FOR FORMING THE SAME 审中-公开
    电子设备及其制造方法

    公开(公告)号：US20080173200A1

    公开(公告)日：2008-07-24

    申请号：US11972291

    申请日：2008-01-10

    申请人： CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

    发明人： CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

    IPC分类号： B41L1/02

    CPC分类号： H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

    摘要： An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

    摘要翻译： 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

    PROCESSES FOR FORMING ELECTRONIC DEVICES INCLUDING SPACED-APART RADIATION REGIONS
    4.
    发明申请
    PROCESSES FOR FORMING ELECTRONIC DEVICES INCLUDING SPACED-APART RADIATION REGIONS 有权
    用于形成包括间隔辐射区域的电子设备的方法

    公开(公告)号：US20100291721A1

    公开(公告)日：2010-11-18

    申请号：US12846979

    申请日：2010-07-30

    申请人： CHARLES DOUGLAS MACPHERSON ,  Gordana Srdanov ,  Gang Yu

    发明人： CHARLES DOUGLAS MACPHERSON ,  Gordana Srdanov ,  Gang Yu

    IPC分类号： H01L33/08

    CPC分类号： H01L51/56 ,  H01L27/3246 ,  H01L27/3283 ,  H01L51/0004 ,  H01L51/52

    摘要： Processes for forming an electronic device include forming a first radiation region, a second radiation region spaced apart from the first radiation region, and an insulating region. The insulating region can have a first side and a second side opposite the first side. The first radiation region can lie immediately adjacent to the first side, and the second radiation region can lie immediately adjacent to the second side. Within the insulating region, no other radiation region may lie between the first and second radiation regions, and the insulating region can include an insulating layer that includes a plurality of openings. A process for forming the electronic device can include patterning an insulating layer.

    摘要翻译： 用于形成电子器件的工艺包括形成第一辐射区域，与第一辐射区域间隔开的第二辐射区域和绝缘区域。 绝缘区域可以具有与第一侧相对的第一侧和第二侧。 第一辐射区域可以紧邻第一侧面，并且第二辐射区域可以紧邻第二侧面。 在绝缘区域内，在第一和第二辐射区域之间不会有其他辐射区域，并且绝缘区域可以包括包括多个开口的绝缘层。 形成电子器件的方法可以包括图案化绝缘层。