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公开(公告)号：US07469638B2
公开(公告)日：2008-12-30
申请号：US11027133
申请日：2004-12-30
Applicant: Charles Douglas MacPherson , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
Inventor： Charles Douglas MacPherson , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
CPC classification number: H01L51/56 , H01L27/3211 , H01L27/3246 , H01L51/0005 , H05K3/1241 , Y10T428/24008
Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.
Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。
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公开(公告)号：US20080282921A1
公开(公告)日：2008-11-20
申请号：US11972246
申请日：2008-01-10
Applicant: CHARLES DOUGLAS MACPHERSON , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
Inventor： CHARLES DOUGLAS MACPHERSON , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
IPC: B41F1/34
CPC classification number: H01L51/56 , H01L27/3211 , H01L27/3246 , H01L51/0005 , H05K3/1241 , Y10T428/24008
Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.
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公开(公告)号：US20080173200A1
公开(公告)日：2008-07-24
申请号：US11972291
申请日：2008-01-10
Applicant: CHARLES DOUGLAS MACPHERSON , DENNIS DAMON WALKER , MATTHEW STAINER , CHRISTOPHER TODD KNUDSON , GANG YU
Inventor： CHARLES DOUGLAS MACPHERSON , DENNIS DAMON WALKER , MATTHEW STAINER , CHRISTOPHER TODD KNUDSON , GANG YU
IPC: B41L1/02
CPC classification number: H01L51/56 , H01L27/3211 , H01L27/3246 , H01L51/0005 , H05K3/1241 , Y10T428/24008
Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.
Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。
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公开(公告)号：US20110222222A1
公开(公告)日：2011-09-15
申请号：US13108573
申请日：2011-05-16
Applicant: CHARLES DOUGLAS MACPHERSON , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
Inventor： CHARLES DOUGLAS MACPHERSON , Dennis Damon Walker , Matthew Stainer , Christopher Todd Knudson , Gang Yu
CPC classification number: H01L51/56 , H01L27/3211 , H01L27/3246 , H01L51/0005 , H05K3/1241 , Y10T428/24008
Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.
Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。
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