公开(公告)号：US20080080847A1

公开(公告)日：2008-04-03

申请号：US11681619

申请日：2007-03-02

Applicant: CHEN FENG ,  MING LEE

Inventor： CHEN FENG ,  MING LEE

IPC: G03B17/00 ,  G02B21/02

CPC classification number: G03B17/00 ,  G02F1/13471 ,  G02F1/29 ,  G02F2001/294

Abstract: A lens module (10) includes a lens barrel (11), at least one fixed focus lens (12) fixed in the lens barrel, and at least two variable focus lenses (13) fixed in the lens barrel. Each variable focus lens includes two electrodes (151) and an electro-optical material (153) between the electrodes. Each electrode is electrically connected to a voltage supply so as to be able to selectively apply a voltage to the electro-optical material and to thus selectively control the refractive index of that material. By changing the refractive index, a concordant change in the focus of a given variable focus lens is possible, without modifying the position and/or shape thereof.

Abstract translation: 透镜模块（10）包括透镜镜筒（11），固定在镜筒中的至少一个固定焦距透镜（12）和固定在镜筒中的至少两个可变焦距透镜（13）。 每个可变焦距透镜在电极之间包括两个电极（151）和电光材料（153）。 每个电极电连接到电压源，以便能够选择性地向电光材料施加电压，并因此选择性地控制该材料的折射率。 通过改变折射率，给定可变焦距透镜的焦点的一致变化是可能的，而不改变其位置和/或形状。

公开(公告)号：US20080023545A1

公开(公告)日：2008-01-31

申请号：US11616832

申请日：2006-12-27

Applicant: CHEN FENG ,  MING LEE

Inventor： CHEN FENG ,  MING LEE

IPC: G06K7/10

CPC classification number: G02B7/02 ,  G02B13/0015 ,  H04N5/2254 ,  H04N5/2257

Abstract: A lens module (200) includes a barrel (20), at least one lens (30) and an image sensing module (40). The lens received in the barrel. The image sensing module is mounted on a mounting end of the barrel and includes an image sensor (41), a top board (42), a carrier with a base board (43), and a filtering film (44). The image sensor is mounted on the base board. The top board is mounted on the carrier to enclose the image sensor. The filtering film is mounted on a surface of the top board.

Abstract translation: 透镜模块（200）包括镜筒（20），至少一个透镜（30）和图像感测模块（40）。 镜头在镜筒里收到。 图像感测模块安装在镜筒的安装端，并且包括图像传感器（41），顶板（42），具有基板（43）的载体和过滤膜（44）。 图像传感器安装在基板上。 顶板安装在载体上以封闭图像传感器。 过滤膜安装在顶板的表面上。

公开(公告)号：US20080019026A1

公开(公告)日：2008-01-24

申请号：US11617135

申请日：2006-12-28

Applicant: CHEN FENG ,  MING LEE

Inventor： CHEN FENG ,  MING LEE

IPC: G02B7/02

CPC classification number: G02B7/02 ,  G02B7/023

Abstract: A lens module (200) includes a barrel (20), a lens (30) and a shielding layer (51). The barrel includes a screening end (21) and a mounting end (22) positioned opposite to the screening end, and defines an aperture (23) in the screening end. A diameter of the aperture reduces in a direction from the screening end to the mounting end so that the aperture has a large diameter and a small diameter. The lens is received in the barrel. The shielding layer made of an opaque film is mounted on the screening end and defines a receiving hole (511) aligned with the aperture. The receiving hole has a diameter being in a range of the large diameter and the small diameter.

Abstract translation: 透镜模块（200）包括镜筒（20），透镜（30）和屏蔽层（51）。 枪管包括一个屏蔽端（21）和一个与屏蔽端相对定位的安装端（22），并在屏蔽端限定一个孔（23）。 孔的直径在从遮蔽端到安装端的方向上减小，使得孔具有大直径和小直径。 镜头接收在镜筒中。 由不透明膜制成的屏蔽层安装在屏蔽端上，并且限定与孔对准的接收孔（511）。 接收孔的直径在大直径和小直径的范围内。

公开(公告)号：US20080054447A1

公开(公告)日：2008-03-06

申请号：US11616838

申请日：2006-12-27

Applicant: CHIH-CHENG WU ,  CHANG-KUO YANG ,  MING LEE

Inventor： CHIH-CHENG WU ,  CHANG-KUO YANG ,  MING LEE

IPC: H01L23/12

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A digital camera module (200) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), a supporting member (25), an adhesive (26), and a cover (28). The carrier has a top surface (211), and a plurality of top contacts (215) arranged on the top surface. The chip is mounted to the top surface of the carrier, and includes an active area (231) and a plurality of pads (233). The wires electrically respectively connect one of the pads to a corresponding top contact. The adhesive is applied to a peripheral circumference of the top surface of the chip. The cover is adhered to the adhesive, and closes the active area of the chip. The supporting member is disposed between the carrier and the cover to support the cover.

Abstract translation: 数字照相机模块（200）包括芯片封装（20）和安装到芯片封装的透镜模块（50）。 包装包括载体（21），芯片（23），多个电线（24），支撑部件（25），粘合剂（26）和盖子（28）。 载体具有顶表面（211）和布置在顶表面上的多个顶部接触（215）。 芯片安装到载体的顶表面，并且包括有源区（231）和多个焊盘（233）。 电线将电极中的一个电连接到相应的顶部触点。 粘合剂被施加到芯片的顶表面的周边。 盖子粘附到粘合剂上，并关闭芯片的有效区域。 支撑构件设置在托架和盖之间以支撑盖。