公开(公告)号：US20230200008A1

公开(公告)日：2023-06-22

申请号：US17980889

申请日：2022-11-04

申请人： Hyundai Motor Company ,  Kia Corporation ,  CHUNG ANG University industry Academic Cooperation Foundation

发明人： Sang Hun LEE ,  Se Heun KWON ,  Seong Min LEE ,  Je Hwan LEE ,  Hyong Joon PARK ,  Yun Seo KIM ,  Geon Hee LEE ,  Dae Young KONG ,  Min Soo KANG ,  Hyoung Soon LEE

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H05K7/20927

摘要： A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

公开(公告)号：US20240355699A1

公开(公告)日：2024-10-24

申请号：US18137187

申请日：2023-04-20

申请人： CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

发明人： Hyoung Soon LEE ,  Dae Young KONG

IPC分类号： H01L23/367 ,  H01L21/48

CPC分类号： H01L23/367 ,  H01L21/4882

摘要： A semiconductor device thermal management module includes a thermal diffusion plate stacked on a semiconductor device for thermal diffusion of the semiconductor device and a heat spreader provided on the thermal diffusion plate, molded by a three-dimensional (3D) printing method, and having a channel through which a cooling fluid flows.