公开(公告)号：US10912218B1

公开(公告)日：2021-02-02

申请号：US16571588

申请日：2019-09-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Marc Henry Mantelli ,  Giridharan Rajagopalan ,  M. Baris Dogruoz ,  Robert Gregory Twiss ,  Joel Richard Goergen

IPC: H05K5/03 ,  H05K7/14 ,  H05K5/02 ,  H01R13/453 ,  H01R12/71 ,  H01R12/70 ,  H01R13/52 ,  H01R13/447

Abstract: In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.