公开(公告)号：US20170287625A1

公开(公告)日：2017-10-05

申请号：US15619355

申请日：2017-06-09

Applicant: CKD Corporation

Inventor： Akihiro ITO ,  Masayuki KOUKETSU ,  Takashi HOSONO ,  Sadayoshi MUTO ,  Takashi TASAKI ,  Yuji OGAWA

IPC: H01F27/28 ,  H01F27/32

CPC classification number: H01F27/2876 ,  H01F5/06 ,  H01F7/06 ,  H01F27/16 ,  H01F27/2847 ,  H01F27/2852 ,  H01F27/324

Abstract: A coil cooling structure comprises a coil which includes a strip-shaped conductor wound around a specific axis a plurality of times; an alumina layer which is formed on an end surface of the coil in the direction of the specific axis through thermal spraying of alumina and whose surface is flattened; a cooling plate which is mainly formed of alumina and has a flow passage for a cooling medium; and an adhesive which bonds the alumina layer and the cooling plate and which elastically deforms depending on a difference in thermal expansion between the alumina layer and the cooling plate.

公开(公告)号：US20150332828A1

公开(公告)日：2015-11-19

申请号：US14812922

申请日：2015-07-29

Applicant: CKD CORPORATION

Inventor： Masayuki KOUKETSU ,  Akihiro ITO ,  Kazutoshi ITOH ,  Takashi HOSONO ,  Sadayoshi MUTO

IPC: H01F5/06 ,  H01F7/08 ,  F16K49/00 ,  F16K31/06 ,  H01F41/06 ,  H01F41/12

CPC classification number: H01F5/06 ,  F16K31/0675 ,  F16K49/00 ,  H01F5/00 ,  H01F7/08 ,  H01F27/08 ,  H01F41/064 ,  H01F41/125 ,  H01J35/14 ,  H01J2235/087 ,  H01J2235/1287 ,  Y10T29/49073 ,  Y10T137/6416

Abstract: An electromagnetic coil includes a conductor winding 12a formed by winding a conductor 12b a plurality of times about a predetermined axis, and a ceramic layer 12c formed through thermal spraying on an axial end surface of the conductor winding 12a, and having a flattened surface. A maximal value t12 of thickness of the ceramic layer 12c is set to three times or less a maximal value t11 of depth of the recesses formed at the surface of turns of the conductor 12b at the axial end surface.

Abstract translation: 电磁线圈包括通过围绕预定轴线多次缠绕导体12b而形成的导体绕组12a，以及通过热喷涂形成在导体绕组12a的轴向端面上并具有扁平表面的陶瓷层12c。 将陶瓷层12c的厚度的最大值t12设定为在轴向端面处形成在导体12b的匝面的凹部的深度的最大值t11的三倍以下。