公开(公告)号：US20190252106A1

公开(公告)日：2019-08-15

申请号：US16393374

申请日：2019-04-24

Applicant: CKD Corporation

Inventor： Akihiro Ito ,  Masayuki Kouketsu ,  Masatoki Ito ,  Takashi Hosono

IPC: H01F27/08 ,  H03H7/01 ,  H01F27/40 ,  H03H3/00 ,  H01F41/06 ,  H05K7/20

CPC classification number: H01F27/08 ,  H01F27/00 ,  H01F27/40 ,  H01F41/06 ,  H03H3/00 ,  H03H7/01 ,  H03H7/0115 ,  H05K7/20145 ,  H05K7/20254

Abstract: A low pass filter including: a coil that includes a band-shaped conductor and is wound a plurality of times around an axis; a capacitor that has one terminal connected to the conductor and the other terminal connected to ground; a cooling plate in contact with an end surface of the wound coil with respect to a direction of the axis; and a ceramic layer that has a flat surface and is disposed on the end surface of the would coil facing the direction of the axis, wherein the ceramic layer contacts the cooling plate, and the cooling plate includes a flow path through which water flows.

公开(公告)号：US09508476B2

公开(公告)日：2016-11-29

申请号：US14812922

申请日：2015-07-29

Applicant: CKD CORPORATION

Inventor： Masayuki Kouketsu ,  Akihiro Ito ,  Kazutoshi Itoh ,  Takashi Hosono ,  Sadayoshi Muto

IPC: H01F7/00 ,  H01F5/06 ,  H01F41/12 ,  F16K49/00 ,  F16K31/06 ,  H01F7/08 ,  H01F5/00 ,  H01J35/14

CPC classification number: H01F5/06 ,  F16K31/0675 ,  F16K49/00 ,  H01F5/00 ,  H01F7/08 ,  H01F27/08 ,  H01F41/064 ,  H01F41/125 ,  H01J35/14 ,  H01J2235/087 ,  H01J2235/1287 ,  Y10T29/49073 ,  Y10T137/6416

Abstract: An electromagnetic coil includes a conductor winding 12a formed by winding a conductor 12b a plurality of times about a predetermined axis, and a ceramic layer 12c formed through thermal spraying on an axial end surface of the conductor winding 12a, and having a flattened surface. A maximal value t12 of thickness of the ceramic layer 12c is set to three times or less a maximal value t11 of depth of the recesses formed at the surface of turns of the conductor 12b at the axial end surface.

Abstract translation: 电磁线圈包括通过围绕预定轴线多次缠绕导体12b而形成的导体绕组12a，以及通过热喷涂形成在导体绕组12a的轴向端面上并具有扁平表面的陶瓷层12c。 将陶瓷层12c的厚度的最大值t12设定为在轴向端面处形成在导体12b的匝面的凹部的深度的最大值t11的三倍以下。